Article
  • A Study on the Filling Pattern Imbalance in High Speed Injection Molding Process for Thin Light Guide Plate
  • Jung TS, Jang JH, Kim JS
  • 초박형 도광판의 고속 사출성형에서 충전 불균형에 대한 연구
  • 정태성, 장진혁, 김종선
Abstract
In this study the filling pattern imbalance was investigated in the injection molding of thin light guide plate by the injection molding simulation and experiments. Injection molding simulation was conducted for thin 8 inch light guide plate (LGP) with 0.6 mm thickness using measured rheological characteristics of resin PC. It is observed that injected resin is heated by adiabatic heating and shear heating and divided into inner layer and outer layer with different temperature. Outer layer resin with high temperature flows into the side section of the cavity, and inner layer resin with relatively low temperature flows into the center section. Thermally separated flows are expected to cause the filling pattern imbalance with a difference in viscosity and flow resistance. Filling patterns of short-shot experiment results for injection speed and temperature were compared with the simulation results. Filling pattern imbalance showed a tendency to increase for higher injection speed and injection temperature.

본 연구에서는 성형해석과 실험을 통하여 초박형 도광판 사출성형에서의 충전 불균형 현상에 대하여 고찰하였다. 8인치, 0.6 mm 초박판 도광판에 대하여 유동계로 측정된 수지의 점도를 이용해 성형 해석을 수행하였다. 해석결과 사출된 수지가 제품부로 유입되기 전 단열가열, 전단가열에 의해 온도가 다른 내외부 영역으로 분리되며, 온도가 높은 외부 수지층은 제품 측면부로 흘러 들어가고, 상대적으로 온도가 낮은 내부 수지층은 제품 중앙부로 유입되면서 점도 차이로 인한 유동저항 차이를 발생시키는 것으로 분석되었다. 수지 온도, 사출 속도 등 실험 조건에 따라 미성형 실험 성형품의 충전 패턴을 해석 결과와 비교하였으며, 사출 속도와 사출 온도가 클수록 측면이 먼저 충전되는 경향이 커지는 결과를 얻었다.

Keywords: high speed injection molding; thin-wall; filling pattern imbalance; shear heating; viscosity

References
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2017; 41(1): 30-38

    Published online Jan 25, 2017

  • 10.7317/pk.2017.41.1.30
  • Received on May 30, 2016
  • Accepted on Aug 1, 2016