Article
  • Fabrication of Polyimide Copolymer Films for Controlled Optical Retardation
  • Nam KH, Lee W, Jang W, Han H
  • 광학 위상지연 조절을 위한 폴리이미드 공중합체 박막 제조
  • 남기호, 이완수, 장원봉, 한학수
Abstract
Poly(amic acid)s were successfully synthesized from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) or 4,4'-hexafluoroisopropylidene diphthalic dianhydride (6FDA) with different molar fractions of 4,4'-oxyaniline (ODA) and 2,2'-bis(3-amino-4-hydroxyphenyl)hexafluoropropane diamine (AHHFP). Stepwise thermal imidization method were used for preparing polyimide copolymer films. Two-axis out-of-plane retardations were detected for optical retardation (R0 and Rth) measurement using an LCD panel measuring device. The optical transparency and yellow index were measured by a ultraviolet-visible (UV-vis) spectrophotometer and a color-difference meter. Their thermal properties were investigated using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The physical properties of PI copolymer films were found to be strongly dependent upon the morphological structure and composition. After all, Rth of PI copolymer films were possibly controlled.

서로 다른 주사슬 구조의 이무수물 3,3',4,4'-benzophenonetetracarboxylic dianhydride(BTDA)와 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride(6FDA)에 4,4'-diaminodiphenyl ether(ODA)와 2,2'-bis(3-amino-4-hydroxyphenyl) hexafluoropropane diamine(AHHFP)를 다양한 몰 비로 각각 반응시켜 삼성분계 폴리아믹산 전구체를 합성하였고, 이를 단계적인 열적 이미드화 공정을 통하여 공중합 폴리이미드 박막을 제조하였다. 디아민 조성비에 따른 공중합폴리이미드 박막의 광학 위상지연은 LCD 패널 측정장치를 이용하여 면 방향 위상지연(R0)과 두께 방향 위상지연(Rth) 값을 측정하였다. 광학 투과도와 황색도는 자외선/가시광선 분광광도계(UV-vis)와 색차계(color-difference meter)를 이용하여 측정하였고, 열 특성은 시차 주사 열량계(DSC)와 열 중량 분석기(TGA)를 이용하였으며, 조성비에 따른 모폴로지 변화를 통해 해석하였다. 제조된 박막의 특성변화는 그 화학구조 및 조성에 따른 모폴로지 변화와 매우 밀접한 관련이 있으며, 이에 따라 박막의 광학 위상지연 조절이 가능함을 확인하였다.

Keywords: polyimide; copolymer; optical retardation

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2016; 40(4): 561-567

    Published online Jul 25, 2016

  • 10.7317/pk.2016.40.4.561
  • Received on Jan 14, 2016
  • Accepted on Apr 11, 2016