Article
  • Curing and Heat Stability of Epoxy Encapsulants with Polysilazane Cross-linking Agent
  • Piao L, Kim JK
  • 폴리실라잔 가교제를 이용한 LED 에폭시 봉지재의 경화와 열 안정성 연구
  • 박용해, 김진권
Abstract
Bisphenol A epoxy and silicone-epoxy LED encapsulants were cured by using polysilazane cross-linking agents, which could be used to initiate the ring-opening polymerization of epoxy group, and the heat stabilities of the encapsulants were examined. Bisphenol A epoxy encapsulants cured by polysilazane showed better heat stability than that with conventional organic cross-linking agents due to the superior heat stability of silicon-based polysilazane cross-linking agent. Silicone-epoxy encapsulants also presented excellent heat stability owing to the high silicon content of polysilazane cross-linking agent. In order to increase the refractive index of the silicone-epoxy encapsulants, TiO2 nanoparticles were dispersed in the silicone-epoxy and cured by polysilazane. The relationship between the refractive index and the TiO2 content was investigated.

본 연구에서는 에폭시 그룹과 가교반응하는 폴리실라잔 가교제를 이용하여 LED용 비스페놀 A 에폭시 봉지 재와 실리콘-에폭시 봉지재를 경화시키고 열 안정성을 연구하였다. 비스페놀 A 에폭시 봉지재는 열 안정성이 높은 실리콘 기반의 반응성 폴리실라잔 가교제를 사용함으로써 기존의 저분자 유기 가교제를 사용할 때에 비해 월등히 높은 열 안정성을 보였고, 실리콘-에폭시 봉지재는 실리콘 함량의 저하 없이 경화시킴으로써 높은 열 안정성을 유지하는데 도움이 되었다. 또한 실리콘 봉지재의 굴절률이 낮은 단점을 보완하기 위해 굴절률이 높은 TiO2 나노입자와 실리콘-에폭시, 폴리실라잔 복합체를 형성하여 입자함량이 굴절률에 미치는 영향을 연구하였다.

Keywords: polysilazane; encapsulation; light-emitting diode; epoxy resin

References
  • 1. Choi J, Kim SG, Laine RM, Macromolecules, 37(1), 99 (2004)
  •  
  • 2. Muth S, Schuurmans FJP, Pashley MD, IEEE J. Sel. Top. Quantum Electron., 8, 333 (2002)
  •  
  • 3. Bourget L, Corriu RJP, Lecercq D, Mutin PH, Vioux A, J. Non-Cryst. Solids, 242, 81 (1998)
  •  
  • 4. Katayama S, Yamada N, Shibata Y, Nosa K, J. Cer. Soc. Jpn., 111, 391 (2003)
  •  
  • 5. Schubert EF, Light Emitting Diodes, Cambridge University Press, UK, Cambridge, 2003.
  •  
  • 6. Mont FW, Kim JK, Schubert MF, Schubert EF, Siege RW, J. Appl. Phys., 103, 083120 (2008)
  •  
  • 7. Ho TH, Wang CS, Eur. Polym. J., 37, 267 (2001)
  •  
  • 8. Rubinsztajn MI, Rubinsztajn S, U. S. Patent 6,916,889 (2005).
  •  
  • 9. Gorczyca TB, U. S. Patent 6,800,373 (2004).
  •  
  • 10. Huang W, Yuan Y, Yu Y, J. Adhes. Inter., 7, 39 (2006)
  •  
  • 11. Peuckert M, Vaahs T, Bruck M, Adv. Mater., 2, 398 (1990)
  •  
  • 12. Crivello JV, Lee JL, J. Polym. Sci. A: Polym. Chem., 28, 479 (1990)
  •  
  • 13. Kubo T, Tataoka E, Kozuka H, J. Mater. Res., 19, 635 (2004)
  •  
  • 14. Lijima M, Kobayakawa M, Kamiya H, J. Colloid Interface Sci., 337(1), 61 (2009)
  •  
  • 15. Song YY, Hildebrand H, Schmuki P, Surf. Sci., 604, 346 (2010)
  •  
  • 16. Sabzi M, Mirabedini SM, Zohuriaan MJ, Atai M, Prog. Org. Coat., 65, 222 (2009)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(5): 733-738

    Published online Sep 25, 2015

  • 10.7317/pk.2015.39.5.733
  • Received on Feb 9, 2015
  • Accepted on May 15, 2015