Article
  • Effect of Acrylic Acid Contents and Inorganic Fillers on Physical Properties of Acrylic Pressure Sensitive Adhesive Tape by UV Curing
  • Kim DB
  • 아크릴산 함량 및 무기물 충전제가 UV 경화형 아크릴 점착테이프의 물성에 미치는 영향
  • 김동복
Abstract
Acrylic pressure sensitive adhesive (PSA) tapes were used for the automotive, the electrical and the electronic industries and the display module junction. In this study, the manufacture of high-strength structural tape used 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC), and UV irradiation for photo-polymerization, and the semi-structural properties of acrylic PSA tape with the AAC content and inorganic filler SiO2 content were investigated. The initial adhesion strength was lowered by the rigidity of molecule chains due to the use of AAC, and the adhesion strength increased with increasing wetting time. The wetability, contact angle, and SEM images of PSA tapes with various contents of AAC were determined. Without filler, the peel strength and dynamic shear strength of PSA tape showed inverse correlation but the peel strength and dynamic shear strength increased with increasing filler content. From these correlations the PSA tapes could be optimized for the applications requiring high performance.

아크릴 점착테이프는 자동차, 전기전자 및 디스플레이 모듈 접합에 사용된다. 본 연구는 이러한 모듈 접합에 사용되는 고강도 준구조형 점착테이프 제조를 위해 2-ethylhexylacrylate(2-EHA)와 acrylic acid(AAC)를 사용하여 UV 조사에 의한 광중합 및 점착테이프 제조를 위해 광경화를 진행하였고, AAC의 함량 및 무기물 충전제 SiO2 함량에 따라 아크릴 점착테이프의 물성에 미치는 영향을 고찰하였다. 공단량체로 사용된 AAC의 함량이 많을수록 아크릴고분자 사슬의 강직성이 증가하여 초기 점착력이 낮았고, 시간경과에 따라 점착력이 증가하였으며 테이프의 젖음성, 접촉각 및 SEM 이미지를 통해 확인할 수 있었다. 충전제를 첨가하지 않은 점착테이프의 박리강도와 전단접 착강도는 반비례 관계였으나 충전제를 첨가하면 함량 증가에 따라 박리강도 증가와 함께 전단접착강도가 증가하는 비례관계를 보였다. 이러한 상관관계로부터 고강도 준구조형 접착물성을 필요로 하는 용도에 최적화된 아크릴 점착 테이프를 제시할 수 있었다.

Keywords: UV curing; pressure-sensitive adhesive; acrylic acid; inorganic filler; adhesion strength.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(2): 184-195

    Published online Mar 25, 2013

  • Received on Oct 19, 2012
  • Accepted on Nov 16, 2012