Article
  • Electromagnetic Interference Shielding Effectiveness and Mechanical Properties of MWCNT-reinforced Polypropylene Nanocomposites
  • Yim YJ, Seo MK, Kim HY, Park SJ
  • 다중벽 탄소나노튜브강화 폴리프로필렌 나노복합재료의 전자파 차폐효과 및 기계적 특성
  • 임윤지, 서민강, 김학용, 박수진
Abstract
In this work, the effect of multi-walled carbon nanotube (MWCNT) on electromagnetic interference shielding effectiveness (EMI SE) and mechanical properties of MWCNT-reinforced polypropylene (PP) nanocomposites were investigated with varying MWCNT content from 1 to 10 wt%. Electric resistance was tested using a 4-point-probe electric resistivity tester. The EMI SE of the nanocomposites was evaluated by means of the reflection and adsorption methods. The mechanical properties of the nanocomposites were studied through the critical stress intensity factor (KIC) measurement. The morphologies were observed by scanning electron microscopy (SEM). From the results, it was found that the EMI SE was enhanced with increasing MWCNT content, which played a key factor to determine the EMI SE. The KIC value was increased with increasing MWCNT content, whereas the value decreased above 5 wt% MWCNT content. This was probably considered that the MWCNT entangled with each other in PP due to an excess of MWCNT.

본 연구에서는 다중벽 탄소나노튜브(MWCNT)의 함량을 1에서 10 wt%까지 달리하여 MWCNT 강화 폴리프로필렌(PP) 나노복합재료의 전자파 차폐효과 및 기계적 특성에 미치는 영향에 대해서 살펴보았다. 전기전도도는 4단자법으로 측정하였고, 전자파 차폐효과는 흡수와 반사방법으로 분석하였다. 기계적 특성은 임계응력세기인자(KIC) 측정을 통하여 고찰하였으며, 모폴로지는 주사전자현미경(SEM)으로 관찰하였다. 실험결과, MWCNT의 함량이 증가함에 따라 차폐효과가 향상됨을 확인할 수 있었으며, MWCNT의 함량이 전자파 차폐효과를 결정하는 중요한 요소임을 알 수 있었다. KIC값도 MWCNT의 함량이 증가할수록 큰 값을 가지는 것을 확인할 수 있었으나 5 wt% 이상에서는 오히려 감소하였다. 이는 과량의 MWCNT가 PP 내에서 서로 뭉침으로 인하여 KIC값을 감소시킨 것으로 판단된다.

Keywords: elecromagnetic interference (EMI); shielding effectiveness (SE); carbon nanotube (CNT); nanocomposites; thermoplastic.

References
  • 1. Kim BR, Lee HK, Park SH, Kim HK, Thin Solid Films., 519, 3492 (2011)
  •  
  • 2. Al-Ghamdi AA, Tantawy FE, Compos. Part A : Appl. Sci.Manuf., 41, 1693 (2010)
  •  
  • 3. Chen CS, Chen WR, Chen SC, Chien RD, Int.Commun. Heat. Mass., 35, 744 (2008)
  •  
  • 4. Shim HB, Seo MK, Park SJ, Polym.(Korea), 24(6), 860 (2000)
  •  
  • 5. Kim YY, Yun J, Lee YS, Kim HI, Carbon Lett., 12, 48 (2011)
  •  
  • 6. Lee BO, Woo WJ, Song HS, Park HS, Hahm HS, Wu JP, Kim MS, J. Ind. Eng. Chem., 7, 305 (2011)
  •  
  • 7. Kim YY, Yun J, Kim HI, Lee YS, J. Ind. Eng. Chem., 18(1), 392 (2012)
  •  
  • 8. Han GY, Song OH, Ahn DG, J. KSPE., 27, 71 (2010)
  •  
  • 9. Chen YH, Huang CY, Lai FD, Roan ML, Chen KN, Yeh JT, Thin Solid Films., 517, 4984 (2009)
  •  
  • 10. Schulz RB, Plantz VC, Brush DR, IEEE Trans.Electromagn. Compat., 30, 362 (1988)
  •  
  • 11. Huang CY, Pai JF, Eur. Polym. J., 34, 261 (1998)
  •  
  • 12. Schulz RB, Plantz VC, Brush DR, IEEE Trans.Electromagn. Compat., 30, 187 (1988)
  •  
  • 13. Wu ZP, Li MM, Hu YY, Li YS, Wang ZX, Yin YH, Chen YS, Zhou X, AAPG Bull., 64, 809 (2011)
  •  
  • 14. Haufler RE, J. Phys. Chem., 94, 8634 (1990)
  •  
  • 15. Liu Q, Zhang D, Fan T, Gu J, Miyamoto Y, Chen Z, Carbon., 46, 461 (2008)
  •  
  • 16. Huang Y, Li N, Ma Y, Du F, Li F, He X, Carbon., 45, 1614 (2007)
  •  
  • 17. Liu Z, Bai G, Huang Y, Ma Y, Li F, Guo T, Carbon., 45, 821 (2007)
  •  
  • 18. Bhadra S, Singha NK, Khastgir D, Curr. Appl. Phys., 9, 396 (2009)
  •  
  • 19. Kim JG, Chung CH, Lee YS, Appl. Chem. Eng., 22(2), 138 (2011)
  •  
  • 20. Chae S, Cho B, Hong B, Lee B, Byun H, Appl. Chem. Eng., 21(4), 430 (2010)
  •  
  • 21. Eswaraiah V, Sankaranarayanan V, Ramaprabhu S, Macromol. Mater. Eng., 296, 894 (2011)
  •  
  • 22. Kim KS, Park SJ, Carbon Lett., 13, 51 (2012)
  •  
  • 23. Chung DDL, Carbon., 39, 279 (2001)
  •  
  • 24. Shui XP, Chung DDL, J. Mater. Sci., 35(7), 1773 (2000)
  •  
  • 25. Chandrasekhar P, Naishadham K, Synth. Met., 105, 115 (1999)
  •  
  • 26. Park SJ, Seo MK, Interface Science and Composites, Elsevier, New York (2011)
  •  
  • 27. Ha CS, Kim SC, J. Appl. Polym. Sci., 35, 2211 (1988)
  •  
  • 28. Seo MK, Lee JR, Park SJ, Mater. Sci. Eng. A., 404, 79 (2005)
  •  
  • 29. Hazra S, Ghosh A, J. Phys. Condens. Matter., 9, 3981 (1997)
  •  
  • 30. Kim CJ, Choi HD, Suh KS, Yoon HG, Polym.(Korea), 27(3), 201 (2003)
  •  
  • 31. Ewalds HL, Wanhill RJH, Fracture Mechanics, Edward Anold, London (1991)
  •  
  • 32. Ko JH, Kim JC, Chang JH, Polym.(Korea), 33(4), 333 (2009)
  •  
  • 33. Kim HC, Jeon S, Kim HI, Choi HS, Hong MH, Choi KS, Polymer(Korea)., 35, 563 (2011)
  •  
  • 34. Yang JS, Shin DH, Lee KY, Park DH, Trans. KIEE., 56, 571 (2007)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2012; 36(4): 494-499

    Published online Jul 25, 2012

  • Received on Jan 10, 2012
  • Accepted on Feb 14, 2012