Article
  • Characteristics of Nylon6/Ionomer Semi IPN for Molded-In-Color Compound
  • Lee J, Hwang JT, Kang HJ
  • 나일론6/이오노머 Semi IPN의 몰드-인-칼라 수지 특성 연구
  • 이재훈, 황진택, 강호종
Abstract
The characteristics of nylon6/ionomer semi interpenetrating networks (IPN) as a molded-in-color (MIC) compound had been studied, and comparison was made with nylon6/ionomer blends. Nylon6/ionomer semi IPN shows better homogeneity in phase morphology than nylon6/ionomer blend, and it caused better anti-scratching performance than the blend. This semi IPN structure resulted in lowered crystallization rate, increased melt viscosity and less temperature dependency of viscosity. As a result, we may expect the enhancement of melt processing characteristics in an injection molding process using nylon6/ionomer semi IPN as a MIC compound.

Molded-in-color(MIC) 수지로 사용 가능한 나일론6/이오노머 semi interpenetrating network(IPN)의 물성을 기존 MIC 수지인 나일론6/이오노머 블렌드와 비교하여 살펴보았다. 나일론6/이오노머 semi IPN은 분자 수준의 믹싱인 IPN 구조를 가져 블렌드에 비하여 상대적으로 개선된 homogeneous 형태학적 구조를 가짐에 따라 내스크래칭 특성이 개선됨을 알 수 있었다. 이러한 semi IPN 구조는 나일론6의 결정화 속도를 감소시키며 용융점도의 증가 그리고 점도의 온도 의존성을 감소시켜 블렌드에 비하여 상대적으로 MIC용 사출 가공 특성이 우수해짐을 예측할 수 있었다.

Keywords: molded-in-color compound; nylon6; ionomer; interpenetrating network; anti-scratching.

References
  • 1. Saltman RP, U. S. Patent 5,091,478 (1992)
  •  
  • 2. Ogiso K, Mukai H, U. S. Patent 5,800,912 (1998)
  •  
  • 3. Kazuhisa Y, Daisuke K, Akihikoc K, Japanese Patent 308441 (1989)
  •  
  • 4. Kuniyuki S, Matsuji K, Masakazu N, Masamichi M, Japanese Patent 301748 (1989)
  •  
  • 5. Toshiki M, Kazuhisa O, Japanese Patent 255842 (1990)
  •  
  • 6. Feinberg SC, U. S. Patent 6,756,443 B2 (2004)
  •  
  • 7. Talkowski CJ, U. S. Patent 5,866,658 (1999)
  •  
  • 8. Feinberg SC, Talkowski CJ, Andersen KC, U. S. Patent 7,144,938 B1 (2006)
  •  
  • 9. Lin CW, Huang YF, Kannan AM, J. Power Sources, 164(2), 449 (2007)
  •  
  • 10. Siegfried DL, Thomas DA, Sperline LH, U. S. Patent 4,468,499 (1984)
  •  
  • 11. Klempner D, Sperling LH, Utracki LA, Interpenetrating Polymer Networks, American Chemical Society (1994)
  •  
  • 12. Hong, J. Hwang, and H. Kim, Korea Patent 0081493 (2010)
  •  
  • 13. Hong T, Hwang J, Kim H, Korea Patent 0049345 (2010)
  •  
  • 14. Hong T, Hwang J, Kim H, Korea Patent 0049362 (2010)
  •  
  • 15. Hong T, Hwang J, Kim H, Korea Patent 0049347 (2010)
  •  
  • 16. Lu XF, Hay JN, Polymer, 42(23), 9423 (2001)
  •  
  • 17. Joshi M, Butola BS, Simon G, Kukaleva N, Macromolecules, 39(5), 1839 (2006)
  •  
  • 18. Cho KC, Lee BH, Hwang KM, Lee HS, Choe SJ, Polym. Eng. Sci., 38(12), 1969 (1998)
  •  
  • 19. Cole KS, Cole RH, J. Chem. Phys., 9, 341 (1941)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2012; 36(4): 407-412

    Published online Jul 25, 2012

  • Received on Sep 22, 2011
  • Accepted on Dec 6, 2011