Article
  • Synthesis and Photoalignment of Soluble Polyimides with Styrylpyridine Side Groups
  • Kim JW, Kim MW, Ahn DK, Kim WS
  • 스티릴피리딘 곁사슬기를 가지는 용해성 폴리이미드의 합성과 광배향
  • 김진우, 김민우, 안득균, 김우식
Abstract
The precursor polyimide of the photoreactive polyimides(PI-SP6 and PI-SP12) was prepared from a derivative of 2, 2, 2-trifluoroethane dianhydride and 3,3′-dihydroxy-4,4′-diaminobiphenyl. PI-SP6 and PI-SP12 were then prepared by the polymer reactions of the precursor polyimide with photoreactive 2-styrylpyridine alkylene (hexylene and dodecylene) derivatives, respectively. The photoreactive polymers were soluble in organic solvents. The polymers showed the initial decomposition temperatures around 350 ℃. The glass transition temperatures of PI-SP6 and PI-SP12 were found to be 130 ℃ and 85 ℃, respectively. This result means that the latter polymer is more flexible than the former polymer. Their transmittance in the film state was 90% at 250 ℃, which indicates that the photosensitive polyimides with thermal stability have high optical transparency even at the high temperature. The respective dichroic ratios of PI-SP6 and PI-SP12 were found to be 0.01 and 0.03 at an exposure energy of 1.5 J/cm2. This result suggests that the latter polymer with larger flexibility compared to the former polymer is more effective for the photoalignment.

감광성 폴리이미드의 전구체 폴리이미드는 2, 2, 2-트리플루오르에탄 디안하이드라이드의 유도체와 3,3′-디히드록시-4,4′-디아미노비페닐로부터 제조하였다. 감광성 폴리이미드(PI-SP6와 PI-SP12)는 전구체 폴리이미드와 감광성 2-스티릴피리딘알킬렌(헥실렌과 도데실렌)유도체로부터 제조하였다. 합성한 광반응성 폴리이미드는 여러 가지 유기 용매에 잘 녹았다. 감광성 폴리이미드의 초기 열분해온도는 350 ℃였다. PI-SP6와 PI-SP12의 유리전이온도는 130 ℃와 85 ℃였다. 이는 헥실렌기를 가지는 PI-SP6 보다 도데실렌기를 가지는 PI-SP12가 유연하다는 것을 의미한다. 이들 감광성 고분자의 필름은 250 ℃에서도 90%의 투과율을 유지하였다. 이 결과는 이들 감광성 폴리이미드가 투명성 및 내열성이 우수한 고분자라는 것을 의미한다. PI-SP6와 PI-SP12는 1.5 J/cm2 광량에서 이색비가 각각 0.01과 0.03이었다. 이 결과는 광배향에 유연한 알킬렌 스페이서를 가지는 감광성 폴리이미드가 보다 효과적이라는 것을 뜻한다.

Keywords: soluble polyimide; transparency; photoalignment; 2-styrylpyridine; alkylene spacer.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(3): 207-212

    Published online May 25, 2009

  • Received on Nov 22, 2008
  • Accepted on Jan 19, 2009