Article
  • Effects of Various Diluents Included in the Resin Matrices on the Characteristics of the Dental Composites
  • Yoo SH, Kim CK
  • 레진 기질에 포함된 희석제들이 치과용 복합 재료의 특성 변화에 미치는 영향
  • 유선화, 김창근
Abstract
The resin matrix in the dental composite is generally composed of 2,2-bis[4-(2-hydroxy- 3-methacryloyloxy propoxy) phenyl] propane (Bis-GMA) as a base resin and triethylene glycol dimethacrylate (TEGDMA) as a diluent for the reduction of viscosity. The applications of dental composite were often limited in dentistry due to the relatively large amounts of volumetric shrinkage during polymerization and water uptake caused by the addition of TEGDMA to the resin matrix. In this study, in order to solve problems stemmed from the TEGDMA by reducing amount of diluent added to resin matrix, diethylene glycol dimethacrylate (DEGDMA) and ethylene glycol dimethacrylate (EGDMA) were explored as new diluents. A decrease in the volumetric shrinkage and an increase in the mechanical strength were observed by replacing TEGDMA in the dental composite to DEGDMA (or EGDMA).Reduction in the mechanical strength of the dental composite containing DEGDMA (or EGDMA), was not serious in comparison with that of the dental composite containing TEGDMA after water uptake.

치과용 복합 재료의 레진 기질은 주로 2,2-bis[4-(2-hydroxy-3-methacryloyloxy propoxy) phenyl] propane(Bis-GMA)와 이의 점도 감소를 위한 희석제인 triethylene glycol dimethacrylate(TEGDMA)로 구성되어 있다. TEGDMA는 복합 재료의 중합 수축률과 흡수율을 증가시켜 치과용 복합 재료의 사용에 제약 요소로 작용하고 있다. 본 연구에서는 희석제 첨가량을 감소시켜 희석제 첨가에 따른 문제점을 해결하기 위해 diethylene glycol dimethacrylate(DEGDMA)와 ethylene glycol dimethacrylate(EGDMA)를 대체 희석제로 검토하였다. 이들 희석제를 이용하여 치과용 복합 재료를 제조해 특성 변화를 관찰한 결과 기존 소재에 비해 중합 수축률 감소와 기계적물성의 증가가 관찰되었다. 특히 DEGDMA 혹은 EGDMA를 사용한 경우 평형 흡수율이 감소되어 흡수에 따른 물성 저하가 기존 재료에 비해 감소하였다.

Keywords: dental composite; resin matrix; diluent; volumetric shrinkage; water uptake.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(2): 153-157

    Published online Mar 25, 2009

  • Received on Oct 17, 2008
  • Accepted on Nov 25, 2008