Article
  • Preparation and Characterization of Tissue Engineered Scaffold Using Porcine Small Intestinal Submucosa and Hyaluronic Acid
  • Lim JY, Kim SH, Khang G, Rhee JM
  • 돼지의 소장점막하 조직과 히알루론산을 이용한 조직공학적 담체의 제조 및 특성분석
  • 임지예, 김순희, 강길선, 이종문
Abstract
The porcine small intestinal submucosa(SIS) without immunorejection responses and hyalunonic acid(HA) can be used as biomaterials. In this study, we tried to design and characterize novel sponge. SIS-HA sponge was prepared by freeze-drying after addition 1wt% HA solution into fabricated SIS sponge. Sponge was crosslinked with 1-ethyl-(3-3-dimethyl aminopropyl) carbodiimide hydrochloride (EDC) solution with 100 mM concentration for 24 hrs and lyophilized. SIS-HA sponge was characterized by scanning electron microscopy and fourier transform infrared spectrometer. And water absorption ability of sponge was evaluated. We seeded NIH/3T3 cells in SIS-HA sponge and cellular attachment was assayed by 3-(4,5-dimethylthiazole-2-yl)-2,5-diphenyltertazolium-bromide(MTT) test. We demonstrated presence of HA in SIS-HA sponge from C-O functional group observed by the FT-IR analysis. Moreover, we confirmed low cytotoxicity and high cell viability of the SIS-HA sponges. Therefore, we could expect that SIS-HA scaffolds are applicable for the tissue regeneration.

면역 거부반응이 없는 돼지 소장점막하조직(small intestinal submucosa, SIS)과 천연보습제인 히알루론산(hyaluronic acid, HA)은 생체재료로 널리 사용되고 있다. 본 연구에서는 이를 이용하여 스폰지를 제조하고 이들의 특성을 분석하였다. SIS-HA 스폰지는 완성된 SIS 스폰지에 1 wt%의 HA겔을 첨가하여 동결건조법으로 제조하고 100 mM의 가교제를 통해 가교하여 이를 전자주사현미경, 적외선분광기, 물흡수성 실험을 하였다. 초기 세포부착률을 확인하고자 NIH/3T3를 분주하여 MTT 분석법을 수행하였다. FT-IR 분석을 통해 C-O관능기가 관찰되어 SIS-HA 스폰지 내부의 HA가 빠져나가지 않고 고르게 분포되어 있음을 확인하였고, MTT분석을 통하여 제조된 스폰지에서의 높은 세포생존율을 확인하였다. 즉, 본 연구에서 제조한 SIS-HA 스폰지는 SIS와 HA 각각의 특성을 모두 내재하고 있어 조직공학적 담체로 적합할 것이다.

Keywords: small intestinal submucosa; sponge; hyaluronic acid; crosslinking; scaffold

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2008; 32(5): 415-420

    Published online Sep 25, 2008

  • Received on Mar 28, 2008
  • Accepted on May 7, 2008