Article
  • Polymer Substrate Materials with Low Dielectric Loss Using Dicyclopentadienyl Bisphenol Cyanate Ester and Polyphenylene Ether
  • Kim DK, Park SD, Lee WS, Yoo MJ, Park SH, Lim JK, Kyoung JB
  • 다이사이클로펜타다이에닐 비스페놀 시아네이트 에스터와 폴리페닐렌에테르를 이용한 저유전손실 고분자 기판 소재
  • 김동국, 박성대, 이우성, 유명재, 박세훈, 임진규, 경진범
Abstract
Polymer substrate materials with low dielectric loss were obtained by fabricating the composite using dicyclopentadienyl bisphenol cyanate ester oligomer and polyphenylene ether (PPE). From the analysis of the curing reaction of oligomer and catalyst, it was observed that the optimum amount of catalyst was 0.02 phr of Zn content. It was applied to the fabrication of polymer composite. By changing oligomer/PPE weight ratio, the peel strength and the gel content of the fabricated composites were measured, and then, the dielectric constant and the dissipation factor were measured in the GHz frequency range. The amount of PPE affected the peel strength and the dielectric properties of composites. However, the amount of catalyst did not affect them at all. Resulting from all experiments, we obtained polymer composite laminates having the peel strength of above 1 kN/m and the low dissipation factor of 0.004 at 1 GHz.

다이사이클로펜타다이에닐 비스페놀 시아네이트 에스터 올리고머와 열가소성 수지인 폴리페닐렌에테르(PPE)를 복합체화함으로써 유전손실이 적은 고분자 기판소재를 제작하였다. 올리고머와 촉매의 경화반응을 분석하여 최적 촉매첨가량을 Zn 0.02 phr로 선정하고 이를 복합체 제작에 적용하였다. 올리고머와 PPE의 함량비를 변화시키며 제작된 복합체의 동박 박리 강도, gel content 등을 측정하였으며, GHz 대역에서의 유전율과 유전손실을 평가하였다. PPE의 함량은 박리 강도 및 유전특성에 큰 영향을 주었으나, 촉매의 함량에 따라서는 유전특성에 큰 차이가 없었다. 실험결과 박리 강도가 1 kN/m 이상이고, 1 GHz에서 유전손실이 0.004로 낮은 고분자 복합체 라미네이트를 얻을 수 있었다.

Keywords: dielectric loss; cyanate ester; polyphenylene ether; dissipation factor; peel strength

References
  • 1. Miyashiro F, Wakabayashi SElectronics Materials toward Ubiquitous Network Age, CMCbooks, Tokyo (2003)
  •  
  • 2. Lee YS, Kim KC, Park SD, Park JC, J. Microelectronics & Packaging Society(Korean), 9, 7 (2002)
  •  
  • 3. Kim HR, PCB Material Technology(Korean)Hongneung Science Pub., Seoul (2006)
  •  
  • 4. Park JH, Park JK, Ceramist(Korean), 4, 41 (2001)
  •  
  • 5. Lee CJ, Kim HJ, Choi SC, J. Kor. Ceram. Soc., 37, 302 (2000)
  •  
  • 6. Sim SH, Kang CY, Choi JW, Yoon YJ, Kim HJ, Choi HW, Yoon SJ, J. Kor. Ceram. Soc., 40, 375 (2003)
  •  
  • 7. Resins for Electronics (Japanese), TRC, Tokyo (2000)
  •  
  • 8. New Trends of Polymers for Electronic Components IV (Japanese), ST-TECHNO, Yokohama (2005)
  •  
  • 9. Ito T, Ichinomiya K, Asami S, Yamada TJapanese Patent 238761 (2003)
  •  
  • 10. Satsuu Y, Amo S, Takahishi A, Watabe N, Unno M, Fujieda T, Akaboshi H, Nagai AJapanese Patent 041966 (2005)
  •  
  • 11. Kaneko K, Hirose T, Goto K, Hasegawa AJapanese Patent 045318 (2006)
  •  
  • 12. Hamerton IChemistry and Technology of Cyanate Ester Resins, Blackie A&P, London (1994)
  •  
  • 13. Deutsch A, Et AL, IEEE Trans. Components, Packaging, and Manufacturing Technology-Part B, 19, 331 (1996)
  •  
  • 14. Gu A, Composites Science and Technology, 66, 1749 (2006)
  •  
  • 15. Kim YD, Kim SC, Polym.(Korea), 19(1), 75 (1995)
  •  
  • 16. Wertz DH, Prevorsek DC, Polym. Eng. Sci., 25, 804 (1985)
  •  
  • 17. Suman JN, Kathi J, Tammishetti S, Eur. Polym. J., 41, 2963 (2005)
  •  
  • 18. Kim YS, Min HS, Kim SC, Macromol. Res., 10(2), 60 (2002)
  •  
  • 19. Recalde IB, Recalde D, Garcia-Lopera R, Gomez CM, Eur. Polym. J., 41, 2635 (2005)
  •  
  • 20. Sase S, Mizuno Y, Fujimoto D, Nomoto M, J. Network Polymer(Japanese), 22, 150 (2001)
  •  
  • 21. Sase S, Mizuno Y, Fujimoto D, Nomoto M, J. Network Polymer(Japanese), 22, 192 (2001)
  •  
  • 22. Sase S, Mizuno Y, Fujimoto D, Takano N, Iijima Y, Negishi H, Sugimura T, Proc. of IPC Printed Circuits Expo 2002S05-2-1 (2002)
  •  
  • 23. Fujimoto D, Mizuno Y, Takano N, Sase S, Negishi H, Sugimura T, Proc. of IEEE Polytronic 2002 Conference, 114 (2002)
  •  
  • 24. Mizuno Y, Fujimoto D, Takano N, Sase S, Iijima T, Negishi H, Sugimura T, Proc. of the 38th IMAPS Nordic Conference, 35 (2001)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2007; 31(6): 474-478

    Published online Nov 25, 2007

  • Received on Jun 6, 2007
  • Accepted on Aug 30, 2007