Article
  • Temperature-Dependent Release of Drug from Copolymers of N-Isopropylacrylamide Containing Liposome
  • Park YS, Han HD, Hong SU, Kim SS, Shin BC
  • 리포솜이 함유된 N-이소프로필아크릴아마이드의 공중합체로부터 온도에 다른 약물의 방출
  • 박영심, 한희동, 홍성욱, 김승수, 신병철
Abstract
Thermosensitive poly(N-isopropylacrylamide) gels containing temperature-sensitive liposomes showing temperature-dependent sol-gel transition were prepared. The surface of temperature-sensitive liposome was modified with copolymers of N-isopropylacrylamide and octadecylacrylate, which exhibited a lower critical solution temperature at around 30 ℃. After mixing the modified temperature sensitive liposomes with poly(N-isopropylacrylamide) solution, the temperature-sensitive liposomes formed physically cross-linked gels through heating the solution above their lower critical solution temperatures. The release of drug from temperature-sensitive liposomes was determined by measuring fluorescence intensity. The drug release from temperature-sensitive liposomes in poly(N-isopropylacrylamide) gel gradually showed sustained-release with increasing temperature.

온도에 의존하여 졸-젤 전이를 나타내는 온도민감성 리포솜을 함유하는 폴리 N-이소프로필아크릴아마이드 젤을 제조하였다. 온도민감성 리포솜의 표면은 30 ℃에서 하한임계용액온도를 나타내는 N-이소프로필아크릴아마이드와 옥타데실아크릴레이트의 공중합체를 이용하여 변형시켰다. 표면이 변형된 온도민감성 리포솜을 폴리 N-이소프로필아크릴아마이드 수용액에 혼합하였다. 혼합용액을 하한임계용액 온도 이상으로 가열했을 때 물리적으로 가교결합이 이루어진 젤의 형태가 이루어지며, 이때 온도 민감성 리포솜이 함유된 폴리 N-이소프로필아크릴아마이드 젤이 만들어진다. 온도민감성 리포솜으로부터 약물의 방출은 형광강도를 측정하여 결정하였다. 폴리 N-이소프로필아크릴아마이드 젤 내부의 온도민감성 리포솜으로부터 약물의 방출은 온도가 증가할수록 지속적인 방출을 나타내었다.

Keywords: liposome; thermosensitive gel; poly(N-isopropylacrylamide); drug release

References
  • 1. Needham D, Dewhirst MW, Adv. Drug Deliver, Rev., 53, 285 (2001)
  •  
  • 2. Kiser PF, Wilson G, Needham D, Nature, 394, 459 (1998)
  •  
  • 3. Meyer DE, Shin BC, Kong GA, Dewhirst MW, Chikoti A, J. Control. Release, 74, 213 (2001)
  •  
  • 4. Kono K, Nakai R, Morimoto K, Takagishi T, Biochim. Biophys. Acta, 1416, 239 (1999)
  •  
  • 5. Leroux JC, Roux E, Garrec DL, Hong K, Drummond DC, J. Control. Release, 72, 71 (2001)
  •  
  • 6. Kono K, Adv. Drug Deliver Rev., 53, 307 (2001)
  •  
  • 7. Kim JC, Bae KS, Kim JD, Biochemistry, 121, 15 (1997)
  •  
  • 8. Jeong B, Bae YH, Lee DS, Kim SW, Nature, 388(6645), 860 (1997)
  •  
  • 9. Pyun DK, Lim YH, An JH, Kim D, Lee DS, Polym.(Korea), 20(2), 335 (1996)
  •  
  • 10. Kim KH, Shin YJ, Polym.(Korea), 18(3), 412 (1994)
  •  
  • 11. Xue W, Hamley IW, Huglin MB, Polymer, 43(19), 5181 (2002)
  •  
  • 12. Sung YK, Jung JH, Choi IJ, Polym.(Korea), 22(1), 84 (1998)
  •  
  • 13. Hayashi H, Kono K, Takagishi T, Bioconjugate Chem., 10, 412 (1999)
  •  
  • 14. Paavola A, Kilpelainen I, Yliruusi J, Rosenberg P, Int. J. Pharm., 199, 85 (2000)
  •  
  • 15. Jeong B, Choi YK, Bae YH, Zentner G, Kim SW, J. Control. Release, 62, 109 (1999)
  •  
  • 16. Matschke C, Isele U, Hoogevest PV, Fahr A, J. Control. Release, 85, 1 (2000)
  •  
  • 17. Shi XY, Li JB, Sun CM, Wu SK, J. Appl. Polym. Sci., 75(2), 247 (2000)
  •  
  • 18. Mayer LD, Hope MJ, Cullis PR, Janoff AS, Biochim. Biophys. Acta, 817, 193 (1985)
  •  
  • 19. Han HD, Kim SS, Choi HS, Shin BC, J. Korean Chem. Soc., 47, 257 (2003)
  •  
  • 20. Lopez O, Maza ADL, Coderch L, Lopez-Iglesias C, Wehrli E, Parra JL, Febs Lett., 426, 314 (1998)
  •  
  • 21. Jung TK, Kim SS, Shin BC, J. Korean Chem. Soc., 47, 59 (2002)
  •  
  • 22. Kaneko Y, Yoshida R, Sakai K, Sakurai Y, Okano T, J. Membr. Sci., 101(1-2), 13 (1995)
  •  
  • 23. Hayashi H, Kono K, Takagishi T, Biochim. Biophys. Acta, 1280, 127 (1996)
  •  
  • 24. Yoshida R, Uchida K, Kaneko Y, Sakai K, Kikuchi A, Sakurai Y, Okano T, Nature, 374(6519), 240 (1995)
  •  
  • 25. Makino K, Hiyoshi J, Ohshima H, Colloids Surf. B: Biointerfaces, 19, 197 (2000)
  •  
  • 26. Hatefi A, Amsden B, J. Control. Release, 80, 9 (2002)
  •  
  • 27. Tiktopulo EI, Bychkova VE, Ricka J, Ptitsyn OB, Macromolecules, 27(10), 2879 (1994)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(1): 59-66

    Published online Jan 25, 2004

  • Received on Oct 29, 2003
  • Accepted on Jan 9, 2004