Article
  • A Study on the PP/PS Blends with Nylon 6 Reactive Compatibilizers
  • Seo SS, Lee KY, Kim SH, Kim DC, Lee SG
  • Nylon6계 반응 상용화제에 의한 PP/PS 블렌드에 관한 연구
  • 서성식, 이기윤, 김성희, 김동철, 이승구
Abstract
RPP(maleic-anhydride grafted PP)and OPS(oxazoline grafted PS) do not react to each other, and thus show immiscibility. In this study, Nylon6 was added to RPP/OPS blend systems, as a reactive compatibilizer for enhancing the miscibility of the blends. When Nylon6 was added to the blends of RPP and OPS, RPP/Nylon6/OPS was produced. The effects of the molar ratio of Nylon6 on the RPP-Nylon6-OPS reaction were studied. Torque test and FT-IR analysis have been carried out to investigate the reaction of RPP/Nylon6/OPS system. The reaction torgue ratio and reaction efficiency show the maximum values at 1：0.66：1 and 1：1：1 (in moles) for RPP/Nylon6/OPS. In the RPP/Nylon6/OPS blends, their mechanical properties were changed with the molar ratio of Nylon6 and showed the highest value at molar ratio of 1.5. Physical properties and compatibility of RPP/Nylon6/OPS were compared with those of PP/Nylon6/PS. Consequently, RPP/Nylon6/OPS plays a proper role as a reactive compatibilizer to the PP/PS blend system.

RPP(maleic-anhydride grafted polypropylene)와 OPS(oxazoline grafted polystyrene) 블렌드는 비혼화성으로서 반응이 일어나지 않으므로 RPP와 OPS에 Nylon6를 반응상용화제로 첨가하였다. RPP, Nylon6, OPS간의 반응을 반응토오크, FT-IR, DSC로 관찰하였다. 3성분계 반응의 결과물로 반응상용화제인 RPP/Nylon6/OPS가 생성됨을 확인하였다. RPP/Nylon6/OPS의 반응은 RPP와 OPS가 1:1일 때 Nylon6의 당량비가 0.66에서 최대 반응토오크를 얻었으며, Nylon6의 당량비가 1일 때 반응 효율이 크게 나타났다. RPP/Nylon6/OPS의 반응에 따른 몰폴로지의 변화를 관찰하여 반응정도가 높을수록 미세한 균일상을 얻었다. 블렌드의 물성은 Nylon6의 당량비가 1.5일때 가장 높은 물성값을 얻었다. 만들어진 RPP/Nylon6/OPS 3성분계 블렌드를 PP/PS 단순 블렌드에 첨가하여 상용성을 고찰하였고 PP/Nylon6/PS 비혼화성 블렌드와 비교분석 하였다. 결과적으로 RPP/Nylon6/OPS가 PP와 PS 블렌드계의 반응상용화제로 적절함을 확인하였다.

Keywords: polypropylene; polystyrene; Nylon6; blend; reactive compatibilizer

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2002; 26(1): 71-79

    Published online Jan 25, 2002

  • Received on Jul 23, 2001
  • Accepted on Nov 22, 2001