Article
  • The Study on the Synthesis and Their Thermal Degradation Properties of Modified Polycarbosilane Preceramics with Platinum Catalyst
  • Hwang TS, Lim JH, Woo HG
  • 백금촉매를 이용한 Modified Polycarbosilane 세라믹 전구체의 합성과 열분해 특성에 관한 연구
  • 황택성, 임정훈, 우희권
Abstract
New ceramic precursors, copolymers of polycarbosilane (PCS) and dichloromethyvinylsilane (DMVS), were synthesized by hydrosilylation with platinum catalyst. The structure of PCS-DMVS copolymers were investigated by using FT-IR and NMR spectrometers. The syntheses of PCS-DMVS copolymers were confirmed by monitoring the change of the absorption bands appearing at 3050, 2100, 1600, 480 cm-1 on the FT-IR spectra. The syntheses of copolymers were also confirmed by the presence of peaks at 3.0, 4.5, 5.9 ppm on the 1H-NMR spectra and at 62 and 130 ppm on the l3C-NMR spectra, which are the characteristic peaks of vinyl group of DMVS. The initial thermal degradation temperature, weight loss and molecular weight of PCS-DMVS copolymers were analysed by thermogravimetric analysis (TGA) and gel permeation chromatography (GPC). The initial thermal degradation temperature of PCS-DMVS copolymer was 483℃. The total weight loss was PCS-DMVS copolymer 20 wt% and significantly decreased comparing with pure PCS at the same degradation condition.

백금촉매를 이용한 hydrosilylation 반응에 의해 difunctional group을 갖는 새로운 세라믹 고분자 전구체를 합성하기 위하여 polycarbosilane (PCS )-dichloromethylvinylsilane (DMVS)공중합체를 합성하였다. 합성한 공중합체의 FT-IR 스펙트럼 결과 3050, 2100, 1600, 480cm-1부근에서 피크 변화와 1H-NMR 및 13C-NMR 스펙트럼의 δ=3.0, 4.5, 5.9 ppm과 δ=130, 62ppm 부근에서 DMVS의 비닐기 (CH2=CH-)에 의한 특성 피크로부터 공중합체의 합성을 확인하였다. 또한 초기 열분해 온도와 열중량 변화 및 분자량 변화를 알아보기 위한 열중량 분석과 GPC 측정결과 촉매량이 0.3 wt%일 때 열분해 초기온도가 483℃로 중량감소는 20wt%로 가장 낮았으며 순수한 PCS의 그것에 비해 중량감소율이 현저히 낮아졌다.

Keywords: polysilane; polycarbosilane; modified polycarbosilane; preceramic polymer; platinum catalyst; thermal degradation

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1998; 22(2): 194-200

    Published online Mar 25, 1998