Article
  • 4,4'-Benzophenone Tetracarboxylic Dianhydride (BTDA) Unit
  • Hwang JM, Cha YJ, Park JH, Ahn TK, Choe S
  • 4,4' -Benzophenone Tetracarboxylic Dianhydride (BTDA)를 함유하는 방향족 폴리이미드의 합성과 접착 특성
  • 황정민, 차윤종, 박정환, 안태광, 최순자
Abstract
Synthesis of polyamic acid (PAA) comprised from 3,3':4,4'-benzophenone tetracarboxylic dianhydride (BTDA) and two diamines, such as 3,3'-diaminodiphenyl sulfone (3,3'-DDSO2) and 4,4'-diaminodiphenyl methane (4,4'-DDM) in cosolvent DMAc, was performed for the adhesion test of partially imidized polyimides (PI). The glass transition temperature and the thermal stability of the partially or fully imidized PI film was measured. PI film cured at 200℃ for 4hrs was adhered on the aluminum substrate at 310∼360℃ and under 200 psi for 20 minutes and the adhesional force of it was about 4∼5 MPa at 25℃ and this value is less than the expected. The adhesional force of the previously treated surface with phosphoric acid was improved the adhesional force as twice much as the previous value. Thus improved surface treatment of the substrate, compact compression on hot-pressor, and controlled temperature of the plate are expected to improve the adhesional force of polyimides. In addition, from the morphology study of the adhered PI film on the substrate, the reaction mechanism is discussed.

접착력 실험에 사용할 폴리이미드 필름을 성형하기 위하여 dianhydride로는 3,3'14,4'-ben- zophenone tetracarboxylic dianhydride (BTDA)를, diamine으로는 3,3'-diaminodiphenyl sulfone (3,3'-DDSO2)과 4,4'-diaminodiphenyl methane (4,4'-DDM)을 용매 DMAc를 이용하여 1단계로 폴리아믹산(PAA)필름을 제조하였다. 부분적으로 또는 완전히 열 이미드화시킨 폴리이미드 (PI) 시료를 이용하여 유리전이온도 및 열 안정성의 기초조사를 하였다. 폴리아믹산 필름을 200℃에서 4시간 동안 열 이미드화시킨 PI 필름을 알루미늄 피착제에 접착 압력 200psi와 310∼360℃의 온도에서 20분 동안 접착한 시료의 접착 강도는 25℃에서 약 4∼5MPa이었다. 인산용액으로 알루미늄 피착제의 전처리 과정을 거쳐 앞서와 같은 접착과정을 거친 PI의 접착력은 7∼8MPa로 약 2배 증가하였다. 이로써 피착제의 충분한 전처리 과정 및 가열압축기로 알루미늄 피착제에 접착할 때의 일정한 압력과 온도 등을 조절한다면 보다 향상된 접착력을 갖는 PI 재료가 가능하리라 본다. 또한 알루미늄 피착제에 접착된 PI 필름의 계면을 SEM사진으로 관찰함으로써 접착시 일어나는 반응메카니즘에 대해 논하였다.

Keywords: poly(amic acid) (PAA); polyimide(PI); adhesion and adhesives; mechanical properties

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1996; 20(5): 839-848

    Published online Sep 25, 1996