Article
  • Miscibility and Crystallization Behavior of Polyesteramide Elastomer/Nylon 6 Blends
  • Jeong HM, Moon SW, Jho JY, Ahn TO
  • Polyesteramide 탄성체/Nylon 6 블렌드의 상용성과 결정화 거동
  • 정한모, 문순원, 조재영, 안태완
Abstract
Polyesteramide (PEA) elastomers and polyamides corresponding to hard sequent of PEA elastomers were synthesized by the solution polymerization of 4,4'-diphenylmethane diisocyanate, dicarboxylic acid-terminated poly (butylene adipate) oligomer, and the mixtures of various kinds of aliphatic dicarboxylic acids. The thermal properties of PEA elastomers and hard segment polyamides, their miscibility behaviors with nylon 6, and the effect of PEA elastomers on the crystallization behavior of nylon 6 were studied. Polymers prepared with aliphatic dicarboxylic acids of lower number of methylene groups were more compatible with nylon 6 and the results were compared with those by binary interaction model. When 10 wt% of PEA elastomers were added, the crystallization rate of nylon 6 increased due to the plasticization effect of PEA elastomers. The crystallization rate of nylon 6 decreased when the content of PEA elastomers further increased, which resulted from the dillution effect of PEA elastomers.

4,4'-Diphenylmethane diisocyanate와 dicarboxylic acid-terminated poly(butyleneadipate) oligomer, 여러 종류의 혼합된 지방족 dicarboxylic acid를 사용하여 polyesteramide(PEA) 탄성체와 그 hard seament에 해당하는 polyarmide를 합성하였다. 합성한 PEA 탄성체와 hard segment polyamide의 구조 및 열적 성질을 조사하였고 nylon 6와의 상용거동 및 nylon 6의 결정화 거동에 미치는 영향을 살펴보았다. PEA 탄성체 및 hard segment polyamide의 mothylene number가 작은 경우 nylon 6와 더 큰 상용성을 보였으며 이를 binary interaction model로부터 예측된 결과와 비교해 보았다. PEA/nylon 6 블렌드에서 PEA 탄성체가 l0wt% 첨가된 경우 PEA 탄성체의 가소화 효과에 의해 nylon 6의 결정화 속도가 증가된 반면 PEA 탄성체의 양이 더 많아지면 희석효과에 의해 nylon 6의 결정화 속도가 감소함을 관찰하였다.

Keywords: polyesteramide elastomer; nylon 6; blend; miscibility; crystallization

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1996; 20(5): 823-831

    Published online Sep 25, 1996