Article
  • Development and Characterization of Low-Dielectric Polyimide-Based Material with Low-Temperature Curing for High-Frequency Electronic Components

  • Young Bin Cho, Kyungsun Kim, Se-Hoon Park, Yunsik Park, and Hyun Jin Nam†

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • 고주파 소자용 저온 경화형 Polyimide 기반 저유전 소재 개발 및 특성 연구

  • 조영빈 · 김경선 · 박세훈 · 박윤식 · 남현진†

  • 한국전자기술연구원 ICT디바이스패키징연구센터

  • Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.

References
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2024; 48(4): 395-402

    Published online Jul 25, 2024

  • 10.7317/pk.2024.48.4.395
  • Received on Feb 29, 2024
  • Revised on Apr 17, 2024
  • Accepted on Apr 17, 2024

Correspondence to

  • Hyun Jin Nam

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • E-mail: hjnam1203@keti.re.kr