Article
  • Enhanced Thermal Conductivity of Epoxy Composites Filled with Cu Foam and Functionalized with MWCNT 3D Network
  • Youjin Kim, Seonmin Lee, and Jooheon Kim

  • School of Chemical Engineering & Materials Science, Chung-Ang University, Seoul 06971, Korea

  • Epoxy/Cu폼/Cu 나노입자가 부착된 MWCNT 고분자 복합체 제조 및 열전도 특성 연구
  • 김유진 · 이선민 · 김주헌

  • 중앙대학교 공과대학 화학신소재공학부

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2018 Impact Factor : 0.500
  • Indexed in SCIE

This Article

  • 2021; 45(1): 56-61

    Published online Jan 25, 2021

  • 10.7317/pk.2021.45.1.56
  • Received on Jul 13, 2020
  • Revised on Aug 10, 2020
  • Accepted on Aug 26, 2020

Correspondence to

  • Jooheon Kim
  • School of Chemical Engineering & Materials Science, Chung-Ang University, Seoul 06971, Korea

  • E-mail: jooheonkim@cau.ac.kr