Differential scanning calorimetry (DSC) and the Kissinger model-fitting showed that the peak curing temperatures of the four kinds of thermally conductive die attach adhesives ranged from 390 to 420 K, and they had high apparent activation energies and had obvious latent features as die attach adhesive at room temperature. T-β extrapolation method was used to determine the curing reaction conditions of the two-series adhesives as 110 ℃ × 1 h + 150 ℃ × 2 h and 120 ℃ × 1 h + 160 ℃ × 2 h, respectively. The basic performance, operation state, die shear test, and environmental reliability of the four kinds of thermally conductive die attach adhesives and the competitive sample S5 were characterized, the PSR-2 can achieve a good packaging effect at lower cost, and is expected to replace the current market mainstream thermally conductive die attach adhesive to reduce high-power lighting light emitting diode (LED) packaging cost.

Keywords: light emitting diode packaging, die attach adhesive, kinetics, silicone resin, thermal conductivity.