Ru Xia† , Manman Sun, Bin Yang† , Jiasheng Qian, Peng Chen, Ming Cao, Jibin Miao, and Lifen Su
College of Chemistry & Chemical Engineering, Key Laboratory of Environment-Friendly Polymeric Materials of Anhui Province, Anhui University, Hefei 230601, Anhui, P. R. China
A series of the thermal conductive polyamide-6 (PA6) composites filled with boron nitride (BN) were prepared by two methods, including melting method (MM) and solution method (SM). The thermal conductivity, morphology, crystallization behavior, thermal stability, and rheological properties of PA6 composites were investigated. The results showed that the thermal conductivity of two methods increased with increase in the filler content, the thermal conductivity of PA6/BN composites containing 40 wt% BN prepared by melting method was up to 1.02W·m-1·K-1, while the thermal conductivity of PA6/BN composites prepared by solution method was up to 1.44 W·m-1·K-1 at the same filler content.
Keywords: polyamide-6, boron nitride, melting method, solution method, thermal conductivity
2018; 42(2): 230-241
Published online Mar 25, 2018
College of Chemistry & Chemical Engineering, Key Laboratory of Environment-Friendly Polymeric Materials of Anhui Province, Anhui University, Hefei 230601, Anhui, P. R. China