Article
  • High-Strain PVC Film Plasticized by TiO2 Nanoparticles
  • Eom WS, Kim YB, Kim SH, Han TH
  • TiO2 나노입자를 이용한 고인장 PVC 필름 제조
  • 엄원식, 김영배, 김성훈, 한태희
Abstract
The low strain and toughness of tetrahydrofuran (THF)-cast poly(vinyl chloride) (PVC) film were mitigated by introducing TiO2 nanoparticles at loading below 0.8 wt%. The thus obtained PVC/TiO2 composite showed superb elongation at break (383%) and toughness (64.7 J m-3) due to modified molecular interactions between nanoparticles and PVC chains.

Tetrahydrofuran(THF)를 이용하여 제조한 poly(vinyl chloride)(PVC) 필름의 낮은 인장률과 인성이 TiO2 나노입자를 0.8 wt% 미만의 농도로 첨가하였을 때 향상되었다. 제조된 PVC/TiO2 복합재료는 383%의 우수한 인장률과 64.7 J m-3의 인성을 나타냈는데, 이는 PVC 고분자 사슬과 나노입자 사이에서 분자간 인력이 작용하기 때문이다.

Keywords: poly(vinyl chloride); TiO2; inorganic nanofiller; high strain

References
  • 1. Du Y, Gao J, Yang J, Liu X, Polym. -Plast. Technol. Eng., 51, 920 (2012)
  •  
  • 2. Hu JM, Jia X, Li CH, Ma ZY, Zhang GX, Sheng WB, Zhang XL, Wei Z, J. Mater. Sci., 49(7), 2943 (2014)
  •  
  • 3. Li KW, JCIIE, 20, 472 (2003)
  •  
  • 4. Atkinson H, Duffull S, J. Pharm. Pharmacol., 43, 374 (1991)
  •  
  • 5. Fried JR, Polymer science and technology, 2nd edition, Prentice Hall, Vicksburg, 2014.
  •  
  • 6. Soong SY, Cohen RE, Boyce MC, Polymer, 48(5), 1410 (2007)
  •  
  • 7. Loff S, Kabs F, Witt K, Sartoris J, Mandl B, Niessen K, Waag K, J. Pediatr. Surg., 35, 1775 (2000)
  •  
  • 8. Tickner JA, Schettler T, Guidotti T, McCally M, Rossi M, Am. J. Ind. Med., 39, 100 (2001)
  •  
  • 9. Moghbeli MR, Tolue S, J. Appl. Polym. Sci., 113(4), 2590 (2009)
  •  
  • 10. Yin B, Hakkarainen M, J. Mater. Chem., 21, 8670 (2011)
  •  
  • 11. Yao K, Gong J, Tian N, Lin Y, Wen X, Jiang Z, Na H, Tang T, RSC Adv., 5, 31910 (2015)
  •  
  • 12. Hosseini SM, Askari M, Koranian P, Madaeni SS, Moghadassi AR, J. Ind. Eng. Chem., 20(4), 2510 (2014)
  •  
  • 13. Liu J, Yan H, Jiang K, Ceram. Int., 39, 6215 (2013)
  •  
  • 14. Xie XL, Liu QX, Li RKY, Zhou XP, Zhang QX, Yu ZZ, Mai YW, Polymer, 45(19), 6665 (2004)
  •  
  • 15. Horikoshi S, Serpone N, Hisamatsu Y, Hidaka H, Environ. Sci. Technol., 32, 4010 (1998)
  •  
  • 16. Zeng XF, Wang WY, Wang GQ, Chen JF, J. Mater. Sci., 43(10), 3505 (2008)
  •  
  • 17. Harzallah OA, Dupuis D, Rheol. Acta, 42(1-2), 10 (2003)
  •  
  • 18. Calo E, Greco A, Maffezzoli A, Polym. Degrad. Stabil., 96, 784 (2011)
  •  
  • 19. Nakajima N, Sadeghi M, Kyu T, J. Appl. Polym. Sci., 41, 889 (1990)
  •  
  • 20. Wan CY, Qiao XY, Zhang Y, Zhang YX, J. Appl. Polym. Sci., 89(8), 2184 (2003)
  •  
  • 21. Da Silva MA, Vieira MGA, Macumoto ACG, Beppu MM, Polym. Test, 30, 478 (2011)
  •  
  • 22. Hasan M, Lee M, Prog. Nat. Sci., 24, 579 (2014)
  •  
  • 23. Chen JL, Xue G, Li YH, Wang L, Tian GH, Macromolecules, 34(5), 1297 (2001)
  •  
  • 24. Gupta SM, Tripathi M, Chin. Sci. Bull., 56, 1639 (2011)
  •  
  • 25. Lee S, Park H, Paik U, Han TH, J. Solid State Chem., 224, 76 (2015)
  •  
  • 26. Fryer DS, Peters RD, Kim EJ, Tomaszewski JE, de Pablo JJ, Nealey PF, White CC, Wu WL, Macromolecules, 34(16), 5627 (2001)
  •  
  • 27. Mali SS, Betty CA, Bhosale PN, Patil P, ECS J. Solid State Sci. Technol., 1, M15 (2012)
  •  
  • 28. Cho S, Choi W, J. Photochem. Photobiol. A-Chem., 143, 221 (2001)
  •  
  • 29. Matsuzawa S, Maneerat C, Hayata Y, Hirakawa T, Negishi N, Sano T, Appl. Catal. B: Environ., 83(1-2), 39 (2008)
  •  
  • 30. Park H, Choi WY, J. Phys. Chem. B, 108(13), 4086 (2004)
  •  
  • 31. Wu DZ, Wang XD, Song YZ, Jin RG, J. Appl. Polym. Sci., 92(4), 2714 (2004)
  •  
  • 32. Zuiderduin WCJ, Westzaan C, Huetink J, Gaymans RJ, Polymer, 44(1), 261 (2003)
  •  
  • 33. Thio YS, Argon AS, Cohen RE, Weinberg M, Polymer, 43(13), 3661 (2002)
  •  
  • 34. Wang Z, Liu J, Wu S, Wang W, Zhang L, Phys. Chem. Chem. Phys., 12, 3014 (2010)
  •  
  • 35. Barrau S, Demont P, Maraval C, Bernes A, Lacabanne C, Macromol. Rapid Commun., 26(5), 390 (2005)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2017; 41(6): 992-997

    Published online Nov 25, 2017

  • 10.7317/pk.2017.41.6.992
  • Received on May 8, 2017
  • Accepted on Jul 24, 2017