Article
  • Preparation of Heat-Resistant, Electrically Conductive Polyacrylonitrile Films and Fibers by the Hydroxylamine/Hydrazine Pretreatment and Copper Sulfide Coating
  • Park HJ, Oh P, Kim YH
  • 히드록실아민/히드라진 전처리와 황화구리 코팅에 의한 내열 도전성 폴리아크릴로니트릴 필름 및 섬유의 제조
  • 박희정, 오필록, 김영호
Abstract
Methods to prepare heat-resistant, electrically conductive PAN films and fibers which maintain their electric conductivity at high temperatures have been studied. Modified PAN (tPAN) films which contained amino and hydroxyl groups and exhibited a high dimensional stability were obtained first by a pretreatment of PAN films with hydroxylamine (HA)/hydrazine solution. Then the tPAN films were coated with copper sulfide (CuS) in an aqueous solution of copper sulfate and sodium thiosulfate. Surface resistance tests of the CuS-tPAN films obtained at various conditions showed that they exhibited better electrical conductivity compared to CuS-PAN films. They maintained their electrical conductivity at temperatures above 200 oC, while CuS-PAN film did not. Energy dispersive X-ray spectroscopy analysis revealed that the loss of electrical conductivity arose from the oxidation of the samples at high temperatures. Electrically conductive CuS-tPAN fibers with a flame retardant property were also prepared using the same method of HA/hydrazine pretreatment, followed by CuS coating.

폴리아크릴로니트릴(PAN) 필름 및 섬유에 히드록실아민(HA)과 히드라진을 함께 전처리한 후, 황화구리를 코팅시켜 도전성이 우수하면서 고온에서도 도전성을 유지하는 내열, 도전성 PAN 필름과 섬유를 제조하는 방법에 대해서 연구하였다. HA와 히드라진을 동시에 PAN 시료에 전처리하여, PAN을 가교시킴과 동시에 아민기와 히드록시기를 도입하여 우수한 형태안정성과 내열성이 부여된 개질 PAN(tPAN) 시료들을 얻었으며, 이렇게 얻은 tPAN 필름을 황산구리/티오황산나트륨 수용액에서 코팅시켜 도전성이 우수한 황화구리 코팅 PAN(CuS-tPAN) 시료를 얻을수 있었다. CuS-tPAN 필름은 CuS-PAN 필름과는 달리 200 oC 이상의 고온에서도 도전성을 유지하였는데, EDS 분석결과 이는 시료의 산화가 늦어지기 때문이었다. CuS-tPAN 필름 제조와 동일한 방법을 사용하여 난연성과 도전성을 갖는 CuS-tPAN 섬유를 제조할 수 있었다.

Keywords: polyacrylonitrile (PAN); film and fiber; hydroxylamine/hydrazine pretreatment; copper sulfide coating; heatresistant; electrical conductivity

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(4): 668-676

    Published online Jul 25, 2015

  • 10.7317/pk.2015.39.4.668
  • Received on Mar 24, 2015
  • Accepted on May 4, 2015