Article
  • Preparation and Characterization of Hybrid Ozone Resistance Coating Film Using Carbon Nanotube
  • Kim SR, Lee SG, Yang JM, Lee JD
  • 탄소나노튜브를 이용한 하이브리드 내오존성 코팅 막의 제조 및 특성
  • 김성래, 이상구, 양정민, 이종대
Abstract
The effect of synthesis conditions such as carbon nanotube (CNT), 2,2,2-trifluoroethylmethacrylate (3FMA), and composition of organic-inorganic material in ozone resistance and surface characteristics of ultraviolet cured organicinorganic hybrid coating film has been investigated. Coating solution was prepared using tetraethoxysilane (TEOS), silane coupling agent methacryloyloxypropyltrimethoxysilane (MPTMS), 3FMA, various organic materials with acrylate group, and CNT, then bar-coated on substrates using applicator, and densified by UV-curing. It was found that ozone resistance and adhesion of the coating film were strongly dependent upon contents of TEOS, 3FMA, and CNT. Especially, ozone resistance, adhesion, and surface hardness of coating film with CNT were improved, relatively. Ozone resistance of coating film with a high TEOS content was increased, but adhesion was decreased. In addition, it was also found that ozone resistance of coating film was increased with contents of 3FMA. On the other hand, surface hardness was decreased with increase of 3FMA.

탄소나노튜브(CNT), 불소계 아크릴레이트 2,2,2-trifluoroethylmethacrylate(3FMA) 및 유-무기 조성비와 같은 합성조건을 달리하여 제조된 자외선 경화형 유-무기 하이브리드 코팅 막의 표면특성 및 내오존성에 대해 연구하였다. 코팅 막은 금속 알콕사이드 전구체인 tetraethoxysilane(TEOS)와 실란 커플링제인 methacryloyloxypropyltrimethoxysilane (MPTMS)로 구성된 유-무기 혼성 용액에 탄소나노튜브 및 3FMA와 자외선 경화를 위한 유기물을 첨가하여 제조된 코팅제를 자외선 경화시켜 제조하였다. 제조된 코팅 막의 내오존성 및 기재와의 접착력은 TEOS, 3FMA 및 CNT의 함량에 크게 영향을 받는다는 것을 확인하였다. 특히, 탄소나노튜브가 첨가된 코팅 막은 우수한 내오존성 및 접착력 뿐만 아니라 높은 표면경도를 나타내었다. TEOS의 경우, 함량이 증가할수록 표면경도 및 내오존성은 향상되었지만, 기재와의 접착력은 감소되었다. 불소아크릴레이트 3FMA의 경우, 함량이 증가할수록 내오존성은 향상되었지만 표면경도는 감소하였다.

Keywords: carbon nanotube; 2,2,2-trifluoroethylmethacrylate; ozone resistance; sol-gel; UV-curable; hybrid coating.

References
  • 1. Oh SK, Kwak GS, Yang SD, J. Arch. Inst. Korea, 19, 87 (2003)
  •  
  • 2. Park HS, Yeom CM, Yoon JY, Journal of Korean Water and Wastewater Works Association (KWWA), 15, 279 (2001)
  •  
  • 3. Jung JM, Kwon SW, Oh SK, J. Korean Inst. Building Construction, 5, 33 (2005)
  •  
  • 4. Kwak KS, Seo HJ, Miyauchi H, Kim GY, Oh SK, J. Arch. Inst. Korea, 26, 79 (2010)
  •  
  • 5. Kim SH, Master of Engineering Thesis, University of Seoul (2010)
  •  
  • 6. Samson F, Coat. Technol., 81, 79 (1996)
  •  
  • 7. Shin YJ, Yang DH, Oh MH, Yoon YS, Shin JS, J. Ind. Eng. Chem., 15(2), 238 (2009)
  •  
  • 8. Jaworek T, Bankowsky H, Koniger R, Reich W, Schrof W, Schwalm R, Macromol. Symp., 159, 197 (2000)
  •  
  • 9. Decker C, Viet TNT, Decker D, Weber-Koehl E, Polymer, 42(13), 5531 (2001)
  •  
  • 10. Gururaj T, Subasri R, Soma Raju KRC, Padmanabham G, Appl. Surf. Sci., 257, 15 (2011)
  •  
  • 11. Lee CH, Lee SG, Kim SR, Lee JD, Korean Chem. Eng. Res., 50(3), 421 (2012)
  •  
  • 12. Sethi S, Dhinojwala A, Langmuir, 25(8), 4311 (2009)
  •  
  • 13. Lee SB, “Technology trends of fluoride materials”, Chemical Materials Information Bank Report (2010)
  •  
  • 14. Hong YT, Lee JH, Kim YS, Polym. Sci. Technol., 14(2), 206 (2003)
  •  
  • 15. Won JU, Joen JP, Lee BJ, Polym. Sci. Technol., 13(6), 724 (2002)
  •  
  • 16. Qu A, Wen X, Pi P, Cheng J, Yang Z, Colloids Surf. A: Physicochem. Eng. Aspects, 345, 18 (2009)
  •  
  • 17. Song K, Zhang Y, Meng J, Green EC, Tajaddod N, Li H, Minus ML, Materials, 6, 2543 (2013)
  •  
  • 18. Baughman RH, Zakhidov AA, de Heer WA, Science, 297, 787 (2002)
  •  
  • 19. Jung II, Haam S, Lim G, Ryu JH, Polym.(Korea), 36(1), 1 (2012)
  •  
  • 20. Sepeur S, Kunze N, Werner B, Schmidt H, Thin Solid Films, 351, 1793 (1999)
  •  
  • 21. Do YW, Yu DS, Lee JH, Park SA, Ha JW, Appl. Chem., 11(1), 9 (2007)
  •  
  • 22. Karatas S, Kizilkaya C, Kayaman-Apohan N, Gungor A, Prog. Org. Coat., 60, 140 (2007)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(5): 573-579

    Published online Sep 25, 2014

  • Received on Jan 22, 2014
  • Accepted on Mar 31, 2014