Article
  • Effects of Tape Thickness and Inorganic Fillers on the Adhesion Properties of Double-sided Acrylic Adhesive Tape by Ultraviolet Curing
  • Kim DB
  • 자외선 경화형 아크릴 양면 점착테이프의 두께 및 무기물 충전제 종류에 따른 접착특성
  • 김동복
Abstract
To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under 250 μm) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in 0.1 μm thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

본 연구는 고성능 준구조용 양면 점착테이프 제조를 위해 2-ethylhexyl acrylate(2-EHA)와 acrylic acid(AAC)를 사용하였고, UV 조사에 의해 시럽을 준비하였다. 양면 점착테이프의 두께, 무기물 충전제 함량 및 충전제 종류에 따른 준구조용 물성에 미치는 영향을 고찰하였다. 테이프의 두께 및 젖음시간이 증가할수록 박리강도가 증가하였다. 두께가 얇은 점착테이프(250 μm이하)의 경우 무기물 충전제의 true density가 낮을수록 적용시간 경과에 따라 박리강도가 높게 나타났다. 무기물 충전제 입자가 클수록 초기 박리강도가 높게 나타났으며, SEM 이미지를 통해 점착테이프 내에 무기물 충전제의 크기를 확인하였다. 다양한 무기물 충전제 및 함량에 따라 박리강도 증가와 함께 전단접착강도가 증가하는 비례관계를 보였으며, 0.1 μm인 양면 점착테이프에서 무기물 충전제는 전단접착강도에 더 영향을 주었다. 이러한 결과로부터 박막형 아크릴 양면 점착테이프는 준구조용 물성을 필요로 하는 용도에 사용가 능할 것으로 사료된다.

Keywords: UV curing; double-sided adhesive tape; inorganic filler; peel strength; dynamic shear strength.

References
  • 1. Satas D, Handbook of Pressure Sensitive Adhesive Technology, 2nd edition, Van Nostrand Reinhold, New York (1989)
  •  
  • 2. Bened I, Pressure-Sensitive Adhesive and Applications, 2nd edition, Marcel Dekker, New York (2004)
  •  
  • 3. Choi HJ, Park IS, Jang L, Korean Patent 100852887 (2008)
  •  
  • 4. Cho IH, Korean Patent 1020080109275 (2008)
  •  
  • 5. Do HS, Kim SE, Kim HJ, Preparation and Characterization of UV-Crosslinkable Pressure-Sensitive Adhesives in Adhesion-Current Research and Applications, Wiley-VCH, Weinheim(Germany) (2005)
  •  
  • 6. Joo HS, Park YJ, Do HS, Kim HJ, Song SY, Choi KY, J. Adhes. Sci. Technol., 21, 5758 (2007)
  •  
  • 7. Do HS, Park YJ, Kim HJ, J. Adhes. Sci. Technol., 20(13), 1529 (2006)
  •  
  • 8. Czech Z, Milker R, Mater. Sci.-Poland, 23, 1015 (2005)
  •  
  • 9. Do HS, Kim SE, Kim HJ, Adhesion-Current Research and Applications, Wiley-VCH, Weinheim (Germany) (2005)
  •  
  • 10. Pizzi A, Mittal KL, Adhesive Technology and Applications, Marcel Dekker, New York (2003)
  •  
  • 11. Kim YC, Lee BH, Journal of Adhesion and Interface, 10, 191 (2009)
  •  
  • 12. ASTM D 3330-96, “Standard Test Method for Peel Adhesion of Pressure Sensitive Tape at 180° Angle” (1997)
  •  
  • 13. Park JW, Lee SW, Kim HJ, Won DB, Kim DB, Lee KS, Woo HS, Kim EA, J. Adhesion and Interface, 12, 81 (2011)
  •  
  • 14. Kim DB, Polym.(Korea), 37(2), 184 (2013)
  •  
  • 15. Tordjeman P, Papon E, Villenave JJ, J. Chem. Phys., 113(23), 10712 (2000)
  •  
  • 16. Morel N, Tordjeman P, Duwattez J, Papon E, J. Colloid Interface Sci., 280(2), 374 (2004)
  •  
  • 17. Cho IM, Kim HG, Han DH, Lim JC, Min KE, Polym.(Korea), 34(3), 226 (2010)
  •  
  • 18. Son HC, Kim HG, Lee DH, Min KE, Polym.(Korea), 32(4), 313 (2008)
  •  
  • 19. Park JW, Lee SW, Kim HJ, Won DB, Kim DB, Lee KS, Woo HS, Kim EA, J. Adhesion and Interface, 12, 81 (2011)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(3): 397-405

    Published online May 25, 2014

  • Received on Feb 20, 2014
  • Accepted on Mar 17, 2014