Article
  • Improvement of Physicochemical Properties of Waterborne Polyurethane/Poly(3,4-ethylenedioxythiophene) Hybrid Thin Films
  • Ko YS, Yim JH
  • 수분산 Polyurethane/Poly(3,4-ethylenedioxythiophene) 혼성 필름의 물리화학적 특성 향상
  • 고영수, 임진형
Abstract
Poly(3,4-ethylenedioxythiophene) (PEDOT) has good properties such as high conductivity, optical transmittance, and chemical stability, while offering relatively weak physicochemical properties. The main purpose of this paper is the improvement of physicochemical properties such as solvent resistance and pencil hardness of PEDOT. Carboxyl groups in the anionic type waterborne polyurethane (WPU) chains can effectively crosslink each other in the presence of aziridine, resulting in physicochemically robust PEDOT/WPU organic-organic hybrid conductive thin films. The electrical conductivity, optical properties, and physicochemical properties of the hybrid conductive film were compared by varying the solid content and WPU portion in the coating precursor solution. From the results, the transparency and surface resistance of the hybrid film show a decreasing tendency with increasing solid content in the coating precursor. Moreover, solvent resistance and hardness were dramatically enhanced by hybridization of PEDOT and crosslinked WPU due to curing reactions between carboxyl groups.

Poly(3,4-ethylenedioxythiophene)(PEDOT)은 높은 전기 전도도, 광학적 투과성 및 좋은 화학적 안정성을 가지고 있는 반면 낮은 물리화학적 물성을 가지고 있다. 본 연구의 목적으로 PEDOT의 내용제성 및 필름경도와 같은 물리화학적 특성을 향상시키고자 하였다. 음이온성 수성폴리우레탄(WPU)이 가지는 카르복실기는 아지리딘 존재 하에서 효과적인 가교반응이 일어나 물리화학적 특성이 개선된 WPU/PEDOT 혼성 전도성 박막을 제조할 수 있다. 다양한 WPU 및 고형분 함량별로 WPU/PEDOT 유기-유기 혼성 박막을 제조하여 전기적/물리화학적 특성을 비교하였다. 고형분 함량이 증가할수록 투과율과 표면저항은 감소하였다. WPU/PEDOT 혼성 전도성 박막의 연필경도와 내용제성이 WPU가 가지는 카르복실기의 가교반응에 인해 효과적으로 증가하였다.

Keywords: conducting polymer; PEDOT; waterborne polyurethane; aziridine; hardness; solvent resistance.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(5): 587-591

    Published online Sep 25, 2013

  • Received on Mar 7, 2013
  • Accepted on May 6, 2013