Article
  • A Study on Thermal Conductivity and Fracture Toughness of Alumina Nanofibers and Powders-filled Epoxy Matrix Composites
  • Choi JR, Park SJ
  • 알루미나 나노섬유와 분말이 첨가된 에폭시 복합재료의 열전도도 특성 및 파괴인성에 대한 연구
  • 최정란, 박수진
Abstract
In this work, the effect of alumina nanofibers on thermal conductivity and fracture toughness of alumina nanofibers and powder filled epoxy (EP) composites were investigated with varying alumina nanofiber content from 20 to 100 phr. Thermal conductivity was tested using a laser flash analysis (LFA). The fracture toughness of the composites were studied through the critical stress intensity factor (KIC) measurement. The mophologies were observed by scanning electron microscopy (SEM). From the results, it was found that the thermal conductivity was enhanced with increasing alumina nanofiber content, which played a key factor to determine the thermal conductivity. The KIC value was increased with increasing alumina nanofiber content, whereas the value decreased above 40 phr alumina nanofiber content. This was probably considered that the alumina nanofiber entangled each other in EP due to an excess of alumina nanofibers.

본 연구에서는 알루미나 나노섬유의 함량을 20에서 100 phr까지 달리하여 알루미나 나노섬유와 분말이 첨가된 에폭시 복합재료의 열전도도 및 파괴인성에 미치는 영향에 대해서 살펴보았다. 열전도도는 열전도도분석기로 측정하였고, 파괴인성은 임계응력세기인자(KIC) 측정을 통하여 고찰하였다. 모폴로지는 주사전자현미경(SEM)으로 관찰하였다. 실험결과, 알루미나 나노섬유의 함량이 증가함에 따라 열전도도가 향상됨을 확인할 수 있었으며, 알루미나 나노섬유의 함량이 열전도도를 결정하는 중요한 요소임을 알 수 있었다. KIC 값도 알루미나 나노섬유의 함량이 증가할수록 큰 값을 가지는 것을 확인할 수 있었으나 40 phr 이상에서는 오히려 감소하였다. 이는 과량의 알루미나 나노섬유가 에폭시 내에서 서로 뭉침으로 인하여 KIC 값을 감소시킨 것으로 판단된다.

Keywords: epoxy; composites; alumina nanofibers; thermal conductivity; fracture toughness.

References
  • 1. Schwartz MM, Nanocomposites Materials Handbook, 2nd ed., McGraw-Hill, New York (1992)
  •  
  • 2. Terasaki I, Comprehensive Semiconductor Science and Technology, Chapter 1.09, 326 (2011)
  •  
  • 3. Ma PC, Siddiqui NA, Marom G, Kim JK, Compos. A;Appl. Sci. Manuf., 41, 1345 (2010)
  •  
  • 4. Martone A, Formicola C, Giordano M, Zarrelli M, Compos.Sci. Technol., 70, 1154 (2010)
  •  
  • 5. Hou Y, Guo LP, Wang G, J. Electroanal. Chem., 617(2), 211 (2008)
  •  
  • 6. Lee GW, Park M, Kim J, Lee JI, Yoon HG, Compos.A; Appl. Sci. Manuf., 37, 727 (2006)
  •  
  • 7. Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)
  •  
  • 8. Nagai Y, Lai GC, J. Ceram. Soc. Jpn., 105, 197 (1997)
  •  
  • 9. Choi YS, Lee HW, Lee JH, Park YI, Kim CE, J. Kor.Cerm. Soc., 32, 995 (1995)
  •  
  • 10. Parker WJ, Jenkins RJ, Butler CP, Abbot GL, J. Appl.Phys., 32, 1679 (1961)
  •  
  • 11. Abdalla M, Dean D, Theodore M, Fielding J, Nyairo E, Price G, Polymer, 51(7), 1614 (2010)
  •  
  • 12. Santos WN, Mummery P, Wallwork A, Polymer., 24, 628 (2005)
  •  
  • 13. Zhou WY, Qi SH, Tu CC, Zhao HZ, Wang CF, Kou JL, J. Appl. Polym. Sci., 104(2), 1312 (2007)
  •  
  • 14. Heo GY, Park SJ, Macromol. Res., 17(11), 870 (2009)
  •  
  • 15. Lee SB, Lee HJ, Hong IK, J. Ind. Eng. Chem., 18(2), 635 (2012)
  •  
  • 16. Park SJ, Park WB, Lee JR, Polym. J., 31, 28 (1999)
  •  
  • 17. Heo GY, Rhee KY, Park SJ, Polym.(Korea), 35(6), 548 (2011)
  •  
  • 18. Hong J, Park DW, Shim SE, Carbon Lett., 11, 347 (2010)
  •  
  • 19. Park SJ, Kim KS, Carbon Lett., 13, 51 (2012)
  •  
  • 20. Tao ZQ, Yang SY, Chen JS, Fan L, Eur. Polym. J., 43, 1470 (2007)
  •  
  • 21. Zhou W, Qi S, Li H, Shao S, Thermochim. Acta., 36, 452 (2007)
  •  
  • 22. Dashora P, Gupta G, Polymer, 37(2), 231 (1996)
  •  
  • 23. Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)
  •  
  • 24. Park SJ, Kim HC, J. Polym. Sci. B: Polym. Phys., 39(1), 121 (2001)
  •  
  • 25. Park SJ, Heo GY, Oh SY, Choi KE, Carbon Lett., 12, 53 (2011)
  •  
  • 26. Deng XL, Yang XP, Carbon Lett., 13, 139 (2012)
  •  
  • 27. Lee WS, Yu J, Diam. Relat. Mater., 14, 1647 (2005)
  •  
  • 28. Santos WN, Mummery P, Wallwork A, Polym. Test., 24, 628 (2005)
  •  
  • 29. Park SJ, Jun BR, J. Colloid Interface Sci., 284(1), 204 (2005)
  •  
  • 30. Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)
  •  
  • 31. Munz DG, Shannon J, Bubsey LJ, Raymond T, Int. J.Fract., 16, 137 (1980)
  •  
  • 32. Smith RP, Li D, Francis DW, Chappuis J, Neumann AW, J. Colloid Interface Sci., 157, 478 (1993)
  •  
  • 33. Lu MG, Shim MJ, Kim SW, Polym. Int., 48, 787 (1999)
  •  
  • 34. Ko JH, Kim JC, Chang JH, Polym.(Korea), 33(4), 333 (2009)
  •  
  • 35. Zheng SX, Wang JA, Guo QP, Wei J, Li JA, Polymer, 37(21), 4667 (1996)
  •  
  • 36. Kim HC, Jeon S, Kim HI, Choi HS, Hong MH, Choi KS, Polymer(Korea)., 35, 563 (2011)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(1): 47-51

    Published online Jan 25, 2013

  • Received on Jul 30, 2012
  • Accepted on Sep 28, 2012