Article
  • The Effects of Polymerization Catalyst Systems on the Synthesis of Poly(2,6-dimethyl-1,4-phenylene ether)
  • Lee CJ, Kim YT, Kim J, Kim JH, Nam SW, Jeon BS, Kim YJ
  • 중합촉매 시스템이 폴리페닐렌에테르의 합성에 미치는 영향
  • 이창재, 김용태, 김진규, 김지흥, 남성우, 전붕수, 김영준
Abstract
Poly(2,6-dimethyl-1,4-phenylene ether) (PPE) was synthesized using Cu(NO2)2·3H2O or CuCl catalyst with various amounts of ligand and base in several different solvent systems. CuCl/1-methylimidazole/ammonium hydroxide was found to be an effective catalyst system which showed the highest polymer yield and molecular weight. The effects of catalyst/monomer ratio, different amine ligands, and the content of mono-functional reagent 2,4,6-trimethylphenol(TMP) additive on the polymer yield and molecular weight were investigated. Among the co-solvent systems used in this polymerization, chloroform/methanol 9/1(v/v) gave the highest polymer yield and molecular weight ( MN 55 K, MW 92 K, PDI 1.7). The catalytic activity between CuCl and CuI was compared by oxygen-uptake experiments and the formation of sideproduct, 5,5´-tetramethyl-4,4´-diphenoquinone (DPQ), was analyzed by ultraviolet spectroscopy.

구리 계열의 Cu(NO2)2·3H2O와 CuCl을 중합촉매로 사용하고 다양한 용매, 리간드와 염기의 함량을 변화시켜 poly(2,6-dimethyl-1,4-phenylene ether)(PPE) 중합반응을 고찰하였다. 이 가운데 CuCl/1-methylimidazole/ammonium hydroxide 시스템에서 가장 높은 중합 수율을 나타내었다. 한편, 몇 가지 다른 유기용매와 메탄올의 혼합용매 시스템에서 용매의 성분비율을 변화시켜 용매의 조성이 중합반응에 미치는 영향을 조사하였으며 2,4,6-trimethylphenol (TMP)를 사용하여 TMP 함량에 따른 분자량 조절 효과를 조사하였다. 클로로포름/메탄올 9/1(v/v) 혼합용매를 사용했을 때 가장 높은 중합 수율과 높은 분자량을 갖는 중합체( MN: 55 K; MW : 92 K; PDI: 1.7)를 얻었다. 구리 일가 촉매인 CuCl 과 CuI를 사용하여 서로다른 짝이온, 즉 Cl-와 I- 이온이 중합결과에 미치는 영향을 조사하였다. 촉매의 활성 비교를 위하여 산소 흡수량(oxygen-uptake)을 측정하였으며, 중합반응의 부산물인 5,5´-tetramethyl-4,4´-diphenoquinone (DPQ)의 함량을 자외선 분광기(ultraviolet spectroscopy)를 통하여 분석하였다.

Keywords: poly(phenylene ether); engineering plastic; oxidative coupling; oxygen-uptake; DPQ; PPE.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2012; 36(1): 98-103

    Published online Jan 25, 2012

  • Received on Sep 6, 2011
  • Accepted on Oct 25, 2011