Article
  • A Study of Synthesis and Property of CaCO3/Organic Core-Shell Particle
  • Seul SD
  • 탄산칼슘 /유기계 Core-Shell 입자의 제조와 물성에 관한 연구
  • 설수덕
Abstract
Core-shell particles of inorganic/organic pair were synthesized from CaCO3 absorbed sodium dodecyl benzene sulfonate(SDBS) surfactant. Shell components were synthesized by sequential emulsion polymerization. Various monomers were used as shell components such as methyl methacrylate(MMA), ethyl acrylate(EA), butyl acrylate(BA), and styrene(St). Ammonium persulfate(APS) was used as an initiator and 2-ethylhexyl acylate(2-EHA) was used as a functional monomer. In the CaCO3/organic core-shell particle polymerization, CaCO3 absorbed surfactant SDBS of 0.5 wt% was prepared first and then core CaCO3 was encapsulated by emulsion polymerization. 0.1 wt% of APS was added sequentially to minimize the formation of new monomer particle during shell polymerization. The structure of inorganic/organic core-shell particles were characterized by measuring the decomposition degree of CaCO3 using HCl solution, thermogravimetric analyzer, scanning electron microscope, and transmission electron microscope.

탄산칼슘/유기계 core-shell 입자를 제조하기 위해 core로는 침강성 탄산칼슘을 사용하였고, shell로서는 여러 종류의 methyl methacrylate(MMA), ethyl acrylate(EA), n-butyl acrylate(BA), styrene(St), 2-ethylhexyl acylate(2-EHA)을 사용하여, 반응 온도, 유화제, 개시제의 종류와 첨가량을 변화시킨 후에 유화중합을 시켜 최적의 유화중합 조건을 구하였다. 생성된 core-shell 입자의 구조는 FT-IR로, 입자크기와 형태는 입도 분석, SEM, TEM으로 각각 측정하였다. 그리고, 이 core-shell 입자에 부직포를 함침시켜 처리전후의 표면변화는 접촉각으로 확인하였다. 또한, 함침 처리 전후의 부직포/부직포 소재와 관능성 단량체 첨가한 부직포/부직포 소재의 박리 접착강도를 측정하여 상호 비교하였다. 탄산칼슘/유기 core-shell 입자 합성의 경우에는 유화제인 SDBS를 0.5wt% 첨가한 탄산칼슘을 core로 하여 MMA와 0.1 wt% 농도의 APS를 단계적으로 주입하여 중합함으로써 탄산칼슘 입자 표면에 단량체의 중합이 잘 유도될 수 있었으며 중합 도중에 새로운 중합체 입자의 생성이 적었다.

Keywords: contact angle; core-shell particle; emulsion polymerization; encapsulation; particle size distribution

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2010; 34(1): 38-44

    Published online Jan 25, 2010

  • Received on Aug 13, 2009
  • Accepted on Sep 29, 2009