Article
  • Characterizations of Adhesion Property, Morphology and Cure Reaction of Epoxy/Polyamide/MPD Reactive Blend with Imidazole(2E4MZ-CN) Catalyst
  • Song HW, Kang HS, Kim WH, Marzi S, Kim BM, Choe YS
  • 이미다졸(2E4MZ-CN) 촉매 첨가에 의한 에폭시/폴리아미드/MPD 반응성 블렌드의 경화 반응, 형태학적 특징 및 접착력 향상 연구
  • 송현우, 강학수, 김원호, 스테판 말지, 김병민, 최영선
Abstract
The morphology and mechanical properties of epoxy/polyamide/MPD/2E4MZ-CN reactive blends with various amount of catalyst were investigated. The cure behaviors, mechanical strengths, and morphological changes of the epoxy blend systems were analyzed by using DSC, UTM, and SEM, respectively. The amount of catalyst ranged from 0 to 3 phr, and the cure reaction occurred at 170℃ for 30 min. The maximum peaks in heat flow during cure reactions appeared at slightly lower temperature with increasing catalyst content, indicating that the cure reactions start at lower temperature by adding catalyst and polyamide rarely hinders the cure reaction paths. The co-continuous morphology was found in epoxy/polyamide(20 phr) blends and by adding catalyst to the blends much clearer and uniform co-continuous phase was observed. The surface tension of the mechanical test specimen was increased due to the AP plasma surface treatment, and then adhesion strength was increased by over 20% by adding 2 phr of catalyst to the blends. When considering morphological tuning of the blends by means of catalyst incorporation, it is expected that the increased elongation and adhesion strength can be achieved in the structural adhesive systems.

본 연구에서는 에폭시(DGEBA)/폴리아미드/MPD/2E4MZ-CN 반응성 블렌드의 경화 촉진제 함량에 따른 블렌드계의 형태학적 특징 및 기계적 물성에 대해 고찰하였다. 본 블렌드계의 경화거동은 DSC, 기계적 강도는 UTM, 형태학적 특징 변화는 SEM을 사용하여 관찰하였다. 이미다졸(2E4MZ-CN) 경화 촉진제의 함량을 0~3 phr까지 조절하였으며, 경화 반응 온도는 170 ℃에서 30분간 유지하였다. 경화 촉진제의 함량이 증가함에 따라 최대 발열 온도가 미세하게 감소하는 경향을 보였으며, 이는 에폭시와의 상용성이 우수한 폴리아미드에 의해 경화 반응이 거의 방해받지 않았음을 보여 준다. 폴리아미드 함량이 20 phr인 조건에서 에폭시 블렌드계는 co-continuous한 분산상을 보이며, 이 조건에서 경화 촉진제의 첨가에 의해 더욱 균일한 co-continuous한 분산상이 나타났다. 상압 플라즈마 표면처리에 의해 표면장력이 증가되어 접착력이 향상되었으며, 경화 촉진제의 함량이 2 phr에서 가장 우수한 접착력을 보여 20% 이상의 접착력 향상 효과가 있었다. 이것은 경화 촉진제에 의한 블렌드계의 형태학적 조절을 고려하면 구조용 접착제에서 보다 향상된 접착력과 연신율을 동시에 기대할 수 있음을 보여 준다.

Keywords: epoxy; polyamide; AP plasma treatment; structural adhesive; morphology.

References
  • 1. Kim DG, Park SY, Park CR, Polym.(Korea), 24(1), 58 (2000)
  •  
  • 2. Pascault JP, Sautereau H, Verdu J, Williams RJJThermosetting Polymers, Plastics Engineering Series/64, Marcel-Dekker Inc., New York, p 226 (2002)
  •  
  • 3. Su CC, Woo EM, Huang YP, Polym. Eng. Sci., 45(1), 1 (2005)
  •  
  • 4. Lahlali D, Naffakh M, Dumon M, Polym. Eng. Sci., 45(12), 1581 (2005)
  •  
  • 5. Prologo SG, Buron M, Rodriquez J, J. Therm. Anal. Cal., 87, 269 (2007)
  •  
  • 6. Prologo SG, Prologon MG, J. Therm. Anal. Cal., 87, 259 (2007)
  •  
  • 7. Prolongo SG, Cabanelas JC, Fine T, Pascault JP, J. Appl. Polym. Sci., 93(6), 2678 (2004)
  •  
  • 8. Arribas C, Masegosa RM, Salom C, Arevalo E, Prolongo SG, Prolongo MG, J. Therm. Anal. Cal., 86, 693 (2006)
  •  
  • 9. Bucknall CB, Gomez CM, Quintard I, Polymer, 35(2), 353 (1994)
  •  
  • 10. Kim BS, Chiba T, Inoue T, Polymer, 36(1), 43 (1995)
  •  
  • 11. Bucknall CB, Partridge IK, Polymer, 24, 639 (1983)
  •  
  • 12. Venderbosch RW, Meijer HE, Lemstra PJ, Polymer, 35(20), 4349 (1994)
  •  
  • 13. Bonnet A, Pascault JP, Sautereau H, Taha M, Camberlin Y, Macromolecules, 32(25), 8517 (1999)
  •  
  • 14. Venderbosch RW, Meijer HE, Lemstra PJ, Polymer, 36(6), 1167 (1995)
  •  
  • 15. Kim BC, Lee DS, Hyun SW, J. Ind. Eng. Chem., 7(6), 449 (2001)
  •  
  • 16. Kim YC, Park SJ, Lee JR, J. Korean Ind. Eng. Chem., 8(6), 960 (1997)
  •  
  • 17. Lee SD, An BH, Lee KK, Kim WH, J. Korean Ind. Eng. Chem., 5, 640 (2004)
  •  
  • 18. Zhong ZK, Guo QP, Polymer, 39(15), 3451 (1998)
  •  
  • 19. ASTM D1002 edition, ASTM International (2005)
  •  
  • 20. Chen YC, Chiu WY, Polymer, 42(12), 5439 (2001)
  •  
  • 21. Barton JM, Hamerton I, Howlin BJ, Jones JR, Liu S, Polymer, 30, 1929 (1998)
  •  
  • 22. Park SJ, Heo GY, Lee JR, Hong YT, Choi KY, Polym.(Korea), 26(5), 599 (2002)
  •  
  • 23. Lee SD, Ahn BH, Lee KG, Kim WH, J. Korean Ind. Eng. Chem., 15(6), 646 (2004)
  •  
  • 24. Park SH, Phuong TV, Song HW, Park KN, Kim BM, Choe Y, J. Korean Ind. Eng. Chem., 19(5), 471 (2008)
  •  
  • 25. Kim MY, Kim WH, Choe Y, Park JM, Park IS, Polym. Int., 51, 1353 (2002)
  •  
  • 26. Kim D, Beak JO, Choe Y, Kim W, Korean J. Chem. Eng., 22(5), 755 (2005)
  •  
  • 27. Hwang S, Kim M, Kim D, Choe Y, Kim W, J. Chem. Eng. Jpn., 38(8), 623 (2005)
  •  
  • 28. Choe Y, Kim W, Macromol. Res., 10(5), 259 (2002)
  •  
  • 29. Noeske M, Degenhardt J, Strudthoff S, Lommatzsch U, Int. J. Adhes. Adhes., 24, 171 (2004)
  •  
  • 30. Green MD, Guild FJ, Adams RD, Int. J. Adhes. Adhes., 81, 22 (2002)
  •  
  • 31. Liston E, Martinu L, Wertheimer MR, J. Adhes. Sci. Technol., 7, 1091 (1993)
  •  
  • 32. Tang, Kwon OJ, Lu N, Choi HS, Sur. Coat. Technol., 195, 298 (2005)
  •  
  • 33. Song HW, Park KN, Park SH, Kang HS, Phuong TV, Nguyen TN, Natarajan SK, Kim WH, Kim BM, Choe Y, Polymer(Korea)submitted.
  •  
  • 34. Ooi SK, Cook WD, Simon GP, Such CH, Polymer, 41(10), 3639 (2000)
  •  
  • 35. Kim DS, Lee JK, Choi EJ, Polym.(Korea), 23(4), 569 (1999)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(4): 290-296

    Published online Jul 25, 2009

  • Received on Oct 24, 2008
  • Accepted on Feb 6, 2009