Article
  • The Effects of Composition, Solvent Selectivity, and Additive on the Morphology of Hybrid Nano Thin Films Composed of Self-Assembled Block Copolymer and Titanium Dioxide
  • Jang YH, Cha MA, Kim DH
  • 자기조립 블록공중합체와 이산화티타늄으로 구성된 하이브리드 나노 박막의 모폴로지에 미치는 고분자의 조성, 용매의 선택성 및 첨가제의 영향
  • 장윤희, 차민아, 김동하
Abstract
Hybrid thin films composed of block copolymer(BCP) and TiO2 with various morphologies on the nanoscale were fabricated using self-assembly of block copolymer combined with sol-gel proccess. The factors governing morphology changes considered in this study are block copolymer composition, selectivity of solvent and the inclusion of an additive. We also investigated the efficiency of photoluminescence for selected films with different morphologies. Micelle or nanowire structure can be derived from the self-assembly of poly(styrene-block-4-vinyl pyridine)(PS-b-P4VP) depending on the relative selectivity of the solvent for the two blocks, and the titanium tetraisopropoxide(Ti{OCH(CH3)2}4, TTIP) is coordinated with nitrogen in P4VP block. Addition of a third component 3-pentadecylphenol into the BCP/sol-gel mixture solution induces morphology change as a result of the change of relative volume fraction of the BCP. We confirmed that the efficiency of TiO2 fluorescence changes for films depending on morphologies.

블록 공중합체의 자기조립현상과 졸-겔 공정을 결합하여 나노크기 수준에서 다양한 형태를 발현하는 블록공중합체-이산화티타늄 하이브리드 박막의 모폴로지를 제조하였다. 모폴로지 변화를 일으키는 요소로서 블록 공중합체의 조성, 용매의 선택성과 첨가제에 의한 영향을 고려하였으며, 모폴로지 변화에 따른 이산화티타늄의 발광 효율 변화 또한 확인하였다. 폴리스티렌-폴리4비닐피리딘 이중블록공중합체는 용매와 두 블록간의 상대적인 친화성에 따라 미셀과 나노선 형태로 자기조립이 가능하며, 이산화티타늄의 전구체인 티타늄 테트라아이소프로폭시드는 폴리4비닐피리딘 블록의 질소 원소와 결합한다. 블록 공중합체/졸-겔 전구체 혼합 용액에 제3의 성분인 3-펜타데실페놀을 첨가하면 블록의 상대적인 부피 비율의 변화를 야기하여 모폴로지 변화를 일으킨다. 다양하게 변화하는 모폴로지에서 이산화티타늄의 형광 효율이 변화함을 확인하였다.

Keywords: block copolymer; poly(styrene-block-4-vinyl pyridine); TiO2; sol-gel; fluorescence

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2008; 32(5): 465-469

    Published online Sep 25, 2008

  • Received on May 12, 2008
  • Accepted on Jun 9, 2008