Article
  • Systhesis and Water Repellency of Polymers with Fluorinated Alkyl Group and Isocyanate Group
  • Baek CH, Kong JY, Hyun SH, Lim YJ, Kim WS
  • 불소화 알킬기와 이소시아네이트기를 가지는 고분자의 합성과 발수성
  • 백창훈, 공종윤, 현석희, 임용진, 김우식
Abstract
The copolymers were prepared by the emulsion copolymerization of fluoroalkylacrylate-lacrylate-m-iso-propenyl-α, α'-dimethylbenzyl isocyanate(TMI) in order to obtain water repellent polymers. The respective copolymerization rates of the three monomers considerably depended upon the use of the nonionic emulsifier and the nonionic-cationic mixed emusifier, and the optimum conditions were obtained. The particle sizes of the copolymers were in the range of 105 to 222 nm. The particle sizes of the copolymers prepared by the use of the mixed emulsifiers were smaller than those of the copolymers prepared by the use of the nonionic emulsifier. The reactions of both TMI-N-methyl acetamide and TMI-cellobiose did not take place. However, the reaction of TMI-n-butylamine occurred. The water contact angles before and after washing three times for nylon and poly(ethylene terephthalate) (PET) fabrics coated with the copolymer prepared by the use of mixed emulsifier were about 139° and 133°. Therefore, the copolymer showed good durable repellency for nylon and PET.

내구발수성 고분자를 얻기 위해 불소화 알킬아크릴레이트-스테아릴아크릴레이트-m-이소프로페닐-α, d-디메틸벤질 이오시아네이트(TMI)를 유화중합시켜 불소화 알킬기와 이소시아네이트기를 가지는 공중합체를 제조하였다. 3 단량체의 공중합속도는 비이온 유화제 및 비이온-양이온 혼합 유화제의 사용에 따라 상당히 의존하였고 그 최적조건을 얻었다. 공중 합체의 입자크기는 105에서 222 nm의 범위에 있었고 비이온-양이온의 혼합 유화제에 의해 만들어진 공중합체가 비이온 유화제로 만들어진 공중합체보다 입자가 작았다. 나일론과 면의 모델 화합물로 N-메틸아세트아미드와 셀로비오스 각각과 TMI는 반응하지 않았다. 반면에 TMI와 부틸아민은 실온에서 반응하였다. 혼합 유화제에 의해 제조된 공중합체를 코팅한 나일론과 PET 천에 대한 세탁 전후의 물의 접촉각은 139℃와 133℃ 정도였다. 따라서 공중합체의 내구발수성은 우수하였다.

Keywords: fluorinated alkyl acrylate; isocyanate group; emulsion copolymerization; durable water repellency; contact angle

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2005; 29(5): 433-439

    Published online Sep 25, 2005

  • Received on Mar 11, 2005
  • Accepted on Jul 11, 2005