Article
  • Synthesis and Properties of Photocurable Epoxy Modified Acrylates Using Half-Ester Acrylates
  • Kim DK, Lim JK, Kim WG, Haw JR
  • 하프-에스터 아크릴레이트를 이용한 광경화형 에폭시 변성 아크릴레이트의 합성과 물성
  • 김동국, 임진규, 김우근, 허정림
Abstract
Various half-ester acrylates were prepared from anhydrides and 2-hydroxyethyl acrylate. Photocurable epoxy modified acrylates were prepared from synthesized half-ester acrylate and neopentylglycol diglycidylether. Physical properties such as hardness, yellowing, tensile strength and elongation were tested and compared as the structure of oligomer in cured-film differs. It was found that viscosity of neopentylglycol diglycidylether-hexahydrophthalic anhydride (NP-HA) was highest. Hardness and tensile strength of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride were better than those of other photocrosslinked epoxy acrylates. And 5% weight loss temperature of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride was higher than those of other photocrosslinked epoxy acrylates. Value of yellow index of photocrosslinked neopentylglycol diglycidyl ether-succinic anhydride (NP-SA) was lower than the other products.

다양한 하프-에스터 아크릴레이트를 합성하기 위하여 다양한 산 무수물에 2-하이드록시에틸 아크릴레이트 (2-hydroxyethyl acrylate)를 반응시켰다. 합성된 하프-에스터 아크릴레이트에 지방족 에폭시 화합물인 네오펜틸글리콜 디글리시딜에테르 (neopentylglycol diglycidylether)를 반응시켜 광경화형 에폭시 변성 아크릴레이트를 제조하였다. 점도는 헥사하이드로프탈산 무수물 (hexahydrophthalic anhydride)을 사용하여 반응시킨 네오펜틸글리콜 디글리시딜에테르-헥사하이드로프탈산 무수물 (NP-HA)이 가장 높았다. 또한 헥사하이드로프탈산 무수물을 사용한 네오펜틸글리콜 디글리시딜에테르-헥사하이드로프탈산 무수물의 광경화물은 비교적 다른 산 무수물을 사용하여 제조한 에폭시 변성 아크릴레이트의 광경화물보다 경도, 인장 강도가 우수하였으며, 5% 무게 감소 온도도 높은 것으로 보아 열적으로 안정하다는 것을 알 수 있었다. 황변 지수값은 숙신산 무수물 (succinic anhydride)을 사용하여 반응시킨 네오펜틸글리콜 디글리시딜에테르-숙신산 무수물 (NP-SA)이 가장 낮았다.

Keywords: epoxy acrylate; photocurable; 2-hydroxyethyl acrylate; half-ester acrylate

References
  • 1. Braithwaite M, Davidson S, Holman R, Lowe C, Oldring PKT, Salim MS, Wall CChemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints, P.K.T. Oldring, Editor, SITA Technology, London (1991)
  •  
  • 2. Pappas SPRadiation Curing, Plenum, New York (1992)
  •  
  • 3. Pappas SPUV Curing: Science and Technology, Technology Marketing Corporation, Connecticut (1983)
  •  
  • 4. Jung JC, Polym.(Korea), 10(6), 570 (1986)
  •  
  • 5. Hoyle CE, Kinstle JFRadiation Curing of Polymeric Materials, American Chemical Society, Washigton DC (1990)
  •  
  • 6. Orcel G, Vanpoulle S, Barraud JY, Boniort JY, Overton B, Wire, 46, 206 (1996)
  •  
  • 7. Rodas AH, Bretas RES, Reggianni A, J. Mater. Sci., 21, 3025 (1986)
  •  
  • 8. Lin SB, Tsay SY, Spechhard TA, Hwang KKS, Jezerc JJ, Cooper SL, Chem. Eng. Commun., 30, 251 (1984)
  •  
  • 9. Speckhard TA, Hwang KKS, Lin SB, Tsay SY, Koshiba M, Ding YS, Cooper SL, J. Appl. Polym. Sci., 30, 647 (1985)
  •  
  • 10. Ali MA, Khan MA, Ali KM, J. Appl. Polym. Sci., 60(6), 879 (1996)
  •  
  • 11. Yoo JW, Kim DS, Polym.(Korea), 23(3), 376 (1999)
  •  
  • 12. Kim HD, Lee DJ, Choi JH, Park CC, Polym.(Korea), 18(1), 38 (1994)
  •  
  • 13. Lee KH, Kim BK, Korea Polym. J., 4(1), 1 (1996)
  •  
  • 14. Kim HD, Kang SG, Ha CS, J. Appl. Polym. Sci., 46, 1339 (1992)
  •  
  • 15. Otsubo Y, Amari T, Watanabe K, J. Appl. Polym. Sci., 29, 4071 (1984)
  •  
  • 16. Matynia T, Kutyla R, Bukat K, Pienkowska B, J. Appl. Polym. Sci., 55(11), 1583 (1995)
  •  
  • 17. Bajpai M, Shukla V, Kumar A, Progress in Organic Coatings, 44, 271 (2002)
  •  
  • 18. Maruno T, Ishibashi S, Nakamura K, J. Polym. Sci. A: Polym. Chem., 32(16), 3211 (1994)
  •  
  • 19. Shi WF, Ranby B, J. Appl. Polym. Sci., 51(6), 1129 (1994)
  •  
  • 20. Williams TR, J. Appl. Polym. Sci., 31, 1293 (1986)
  •  
  • 21. Bongiovanni R, Malucelli G, Sangermano M, Priola A, Prog. Org. Coat., 36, 70 (1999)
  •  
  • 22. Kim JK, Kim DK, Hwang JY, J. Korean Ind. Eng. Chem., 14, 6 (2003)
  •  
  • 23. Lim JK, Kim DK, Kim WG, J. Korean Ind. Eng. Chem., 15(2), 225 (2004)
  •  
  • 24. Kim YC, Roh JB, Lee BJ, J. Korean Ind. Eng. Chem., 13(6), 538 (2002)
  •  
  • 25. Hong JW, Park MY, Kim HK, Kim Y, Choi HK, J. Korean Ind. Eng. Chem., 11(6), 693 (2000)
  •  
  • 26. Hong JW, Lee HW, J. Korean Ind. Eng. Chem., 5(5), 857 (1994)
  •  
  • 27. Kim DK, Lim JK, Kim WG, J. Korean Ind. Eng. Chem., 15, 749 (2004)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(6): 531-537

    Published online Nov 25, 2004

  • Received on Aug 23, 2004
  • Accepted on Nov 19, 2004