Article
  • Preparation and Characterization of Sponge Using Porcine Small Intestinal Submucosa
  • Shin HW, Kim SH, Jang JW, Kim MS, Cho SH, Lee HB, Khang G
  • 돼지의 소장 점막하 조직을 이용한 스폰지의 제조 및 특성 결정
  • 신혜원, 김선화, 장지욱, 김문석, 조선행, 이해방, 강길선
Abstract
Porcine small intestine submucosa (SIS) has been widely used as a biomaterial without immunorejection responses. Crosslinked SIS sponges were characterized for the possibility of the bio-interactive wound dressings and tissue engineered scaffolds. SIS powders were dissolved in 3% acetic acid aqueous solution at 48 hrs followed by pouring into mold and then fabricated by freeze-drying method. SIS sponge was prepared by crosslinked with 1-ethyl-(3,3-dimethyl aminopropyl) carbodiimide hydrochloride (EDC) solution (deionized water : ethanol = 5 : 95) with 1 ~ 100 mM concentration for 24 hrs and lyophilized. SIS sponges were characterized by scanning electron microscopy, differential scanning calorimeter, and Fourier transform infrared spectrometer and were tested their porosity and water absorption ability. It was observed that the concentration of EDC might be exceeded 50 mM to get good physical characteristics. In conclusion, it seems that SIS sponge could be very useful for the applications of wound healing and tissue construction.

돼지의 소장 점막하 조직은 면역반응이 없는 재료로 널리 사용되고 있다. 본 연구에서는 소장 점막하 조직을 1-ethyl-(3,3-dimethyl aminopropyl) carboimide hydrochloride (EDC)를 이용하여 경화시켰으며 동시에 스폰지 형태로 제조하여 조직공학적 담체와 상처 드레싱재료로서의 응용 가능성을 검토하였다. 다세포 구성분을 제거한 소장 점막하 조직 분말을 3% 아세트산에 용해하여 일정한 형태의 몰드 내에 붓고 동결건조하였다. 이 소장 점막하 조직 스폰지를 여러 농도의 DEC 용액에 침지하여 가교반응을 실시하였다. 이를 전자주사 현미경, 시차 주사열량계, 적외선 분광분석기, 다공도 테스트 및 흡수성 실험을 수행하여 특성을 결정하였다. 소장 점막하 조직 스폰지는 경화제의 농도가 50 mM 이상에서 물리적 특성이 우수한 것으로 판단되었다. 일련의 실험을 통하여 경화된 소장 점막하 조직 스폰지가 조직공학적 담체와 상처치료 드레싱재료로 유용하게 사용될 수 있음을 확인하였다.

Keywords: small intestinal submucosa; sponge; collagen; wound dressing; crosslinking

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(2): 194-200

    Published online Mar 25, 2004

  • Received on Dec 4, 2003
  • Accepted on Mar 20, 2004