Article
  • Impact Behaviors of Ni-plated Carbon Fibers-reinforced Epoxy Matrix Composites
  • Park SJ, Kim BJ, Rhee JM
  • 니켈도금된 탄소섬유 강화 에폭시 수지 복합재료의 충격 특성
  • 박수진, 김병주, 이종문
Abstract
In this work, two types of Ni-plating, namely electrolytical and electroless Ni-platings on carbon fiber surfaces, were carried out to enhance the impact resistance of composites. And the comparison between electrolytical and electroless methods on their impact properties of composite system was studied. The surface properties of carbon fibers were characterized using XRD, SEM, and contact angle measurements. The impact behaviors were investigated using an Izod type impact tester. As experimental results, it was observed that electrolessly plated Ni layers had Ni-P alloys on carbon fiber surfaces as revealed by XRD, and electrolytically Ni-plated carbon fibers showed higher surface free energies than those of the electrolessly Ni-plated carbon fibers. In particular, the impact strengths of electrolessly Ni-plated carbon fibers-reinforced plastics were strongly increased. These results were probably due to the difference of wettabilities according to the different types of Ni-plating methods.

본 연구에서는 탄소섬유 강화 에폭시 수지 복합재료의 충격 특성 향상을 위해 탄소섬유표면에 전해 및 무전해 니켈도금처리를 하였으며, 이때 각각의 니켈도금법에 따른 충격 특성을 비교 고찰하였다. 도금된 탄소섬유의 표면 특성은 XRD, SEM, 그리고 접촉각 측정을 통해 관찰하였고, 탄소섬유 강화 복합재료의 충격 특성은 Izod형의 충격시험기를 이용하여 분석하였다. 실험결과, 무전해 니켈도금층에는 전해도금층과는 달리 Ni-P 합금이 포함된 것이 XRD를 통하여 확인되었으며, 전해 니켈도금된 탄소섬유가 무전해 니켈도금된 것보다 표면자유에너지가 큰 것이 접촉각 측정을 통해 관찰되었다. 한편, 무전해 니켈도금된 탄소섬유 강화 에폭시 수지 복합재료는 충격강도가 크게 증가하였으나, 전해 니켈도금된 복합재료의 경우는 충격강도가 증가하지 않았다. 이러한 결과는 각각의 도금법에 따른 젖음성의 차이가 탄소섬유 강화 복합재료의 연성을 변화시켜 충격강도 증가에 주요하게 작용되었기 때문으로 사료된다.

Keywords: electroless and electrolytic Ni-plating; carbon fibers-reinforced plastics; impact strength

References
  • 1. Donnet JB, Bansal RCCarbon Fibers, 2nd Ed., Marcel Dekker, New York (1990)
  •  
  • 2. Smith WSEngineered Materials Handbook, ASM International, Ohio, Vol. 1 (1987)
  •  
  • 3. Schwartz MMComposite Materials Handbook, 2nd Ed., McGraw-Hill, New York (1992)
  •  
  • 4. Fitzer ECarbon Fibers and Their Composites, Springer-Verlag, New York (1992)
  •  
  • 5. Bauer RSEpoxy Resin Chemistry, in ACS Advances in Chemistry Series No. 114, American Chemical Society, Washington D.C. (1979)
  •  
  • 6. Lee H, Nevile KHandbook of Epoxy Resins, McGraw-Hill, New York (1967)
  •  
  • 7. Park SJInterfacial Forces and Fields: Theory and Applications, J.P. Hsu, Editor, Marcel Dekker, New York, Chapter 9 (1999)
  •  
  • 8. Park SJ, Lee JR, J. Mater. Sci., 33(3), 647 (1998)
  •  
  • 9. Hage E, Costa SF, Pessan LA, J. Adhes. Sci. Technol., 11(12), 1491 (1997)
  •  
  • 10. Park SJ, Jang YS, Rhee KY, J. Colloid Interface Sci., 254, 383 (2002)
  •  
  • 11. Donnet JB, Park SJ, Carbon, 29, 955 (1991)
  •  
  • 12. Donner JB, Park SJ, Wang WD, Polym. Adv. Technol., 3, 395 (1993)
  •  
  • 13. Dilsiz N, Wightman JP, Carbon, 37, 1105 (1999)
  •  
  • 14. Lu G, Li X, Jiang H, Compos. Sci. Technol., 56, 193 (1996)
  •  
  • 15. Li H, Chen H, Dong S, Yang J, Deng JF, Appl. Surf. Sci., 125, 115 (1998)
  •  
  • 16. Park SJ, Jang YS, J. Colloid Interface Sci., 237(1), 91 (2001)
  •  
  • 17. Lynch ET, Kershaw JPMetal Matrix Composites, CRC, Cleveland (1972)
  •  
  • 18. Jahazi M, Jalilian F, Combust. Sci. Technol., 59, 1969 (1999)
  •  
  • 19. Soni PR, Rajan TV, Ramakrishnan P, Met. Mater. Proc., 8, 187 (1996)
  •  
  • 20. Charrier JMPolymeric Materials and Processing, Hanser, Munich (1990)
  •  
  • 21. Abraham S, Pai BC, Satyanarayana KG, Vaidyan VK, J. Mater. Sci., 25, 2839 (1990)
  •  
  • 22. Han KP, Fang JL, J. Appl. Electrochem., 26(12), 1273 (1996)
  •  
  • 23. Li H, Wang W, Chen H, Deng JF, J. Non-Cryst. Solids, 281, 31 (2001)
  •  
  • 24. Park SJ, Kim MH, Lee JR, Choi S, J. Colloid Interface Sci., 228(2), 287 (2000)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2003; 27(1): 52-60

    Published online Jan 25, 2003

  • Received on Sep 23, 2002
  • Accepted on Nov 12, 2002