Article
  • Orientation and Phase Separated Structure of Polyurethanes Having Various Chemical Strictures
  • Yoo SR, Lee HS, Seo SW
  • 폴리우레탄 탄성체의 화학적 구조의 변화가 분자쇄 배향 및 상분리 구조에 미치는 영향
  • 유소라, 이한섭, 서승원
Abstract
Two sets of polyurethanes were prepared with 4,4'-methylenebis(phenol isocyanate) (MDI), poly(tetramethylene oxide) (PTMO) of various molecular weight and either butane diol (BD) or propylene diamine (PDA) as a chain extender. The deformation behavior and thermal stability of the polyurethanes were investigated by changing the molecular weight of the soft segment in the range of 650-2500 g/mol and the type of the chain extender FT-IR spectroscopy, polarized optical microscopy, Synchrotron X-ray, Instron and DSC were used for those purposes. The polyurethanes having diamine chain extender exhibited greater degree of phase separation and better thermal stability than those having diol chain extender. It was observed that the deformation and thermal properties of the polyurethanes were strongly affected by the molecular weight of the soft segment. The correlation between the internal structure of the polyurethanes and the molecular weight of the soft segment was investigated.

폴리우레탄의 구조-물성간의 상관관계를 관찰하기 위하여 4,4'-methylenebis(phenyl isocyanate) (MDI)-butanediol (BD)의 hard segment 또는 MDI-propylenediamine (PDA)의 hard segment와 다양한 분자량의 soft segment로 이루어진 폴리우레탄을 검토하였다. Soft segment는 분자량이 650-2500g/mo1인 poly(tetramethylene oxide) (PTMO)를 사용하였고 soft segment의 길이 변화에 따른 연신 성질과 열적 성질의 변화를 관찰하였다. 연신 거동을 관찰하기 위해서 FT-IR, 편광현미경, Synchrotron X-ray, Instron 등을 이용하였고 DSC, FT-IR, Synchrotron X-ray 등을 통하여 열적 안정성을 측정하였다. Diamine이 쇄연장제로 도입된 폴리우레탄은 diol이 도입된 것보다 더 높은 상분리도를 보였으며 hard domain의 열안정성도 더 뛰어났다. Soft segment의 분자량 차이는 domain 구조의 차이를 발생시켰고 그로 인해 배향 거동의 차이뿐만 아니라 열적 안정성에 있어서도 차이를 유발하였다.

Keywords: polyurethane; deformation; thermal; phase separated structure

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1997; 21(3): 467-479

    Published online May 25, 1997