Article
  • Swelling-Contraction Behavior of New HSMA/PVA IPN Gels under Electric Field
  • Han YK, Lee SK, Kim YH, Park OO
  • 새로운 HSMA/PVA IPN 겔의 전장 변화에 의한 팽윤-수축 거동에 관한 연구
  • 한양규, 이상균, 김영하, 박오옥
Abstract
Hydrolyzed styrene-maleic anhydride alternating copolymers(HSMA) from the hydrolysis of styrene-maleic anhydride alternating copolymer(SMA) were mixed with poly(ethylene glycol 600 diglycidyl ether) as a crosslinker and poly(vinyl alcohol) (PVA), and then crosslinked for interpenetrating polymer networks(IPN) to give new electro-responsive HSMA/PVA IPN gels. General swelling behaviors of gels were investigated in water, sodium chloride, and sodium hydroxide solutions. Electro- responsive behavior of the gel was different from the conventional gels showing a contraction phenomenon, that is, all the prepared gels were swelled in the presence of electric field. The degree of swelling of the gels was increased wit increasing the concentration of PVA and the strength of electric field applied. Response time for the deformation of swelled gels was dependent on the crosslinking density and the electric field strenffh, and u·as independent of the composition of PVA. When a constant electric field is switched on and off, HSMA/PVA IPN gels showed an on-off switching function which represents a reversible change of swelling-contraction for a long time(about 100 cycles).

스티렌-무수말레인산(SMA) 교대공중합체를 가수분해시켜 얻은 HSMA에 가교제인 poly(ethylene glycol 600 diglycidyl ether)와 폴리비닐알콜(PVA)을 첨가한 다음 가교시켜 상호침투하는 망상구조(IPN)를 갖는 새로운 전장응답성 HSMA/PVA IPN겔을 제조하였다. 제조된 겔의 일반적인 팽윤 거동을 증류수, 염화나트릅 및 수산화나트륨 수용액에서 조사하였다. 전장변화에 의한 응답 거동을 조사한 결과. 전장 하에서 수축되는 기존의 고분자 겔들과는 달리 합성된 모든 겔들은 팽윤되는 새로운 현상을 발견하였다. 또한 겔에 인가된 전장의 세기 및 겔 내의 PVA 농도가 증가될수록 팽윤도가 증가됨을 확인하였다. 겔의 변형을 위한 응답시간은 가교밀도 및 전장의 세기에 의존하였으나 PVA 농도와는 무관하였다. 합성된 HSMA/PVE IPN 겔은 일정한 전장이 on-off될 때 팽윤-수축 현상이 규칙적으로 오랫동안(약100회) 유지되는 우수한 on-off switching 기능을 보였다.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1993; 17(4): 407-414

    Published online Jul 25, 1993