Article
  • Electrical Properties of Electroconductive Acrylic Composites
  • Park YH, Lee MK, Kim YK
  • 전도성 아크릴 복합체의 전기적 성질
  • 박연흠, 이민구, 김용권
References
  • 1. Ching CK, Dury MA, Gau SC, Heeger AJ, Louis EJ, MacDiarmid AG, Park YW, Shirakawa H, J. Am. Chem. Soc., 100, 1013 (1978)
  •  
  • 2. Naarmann HSymposium on Conducting Polymers: Their Emergence and Future, Am. Chem. Soc., Meeting, Denver, Col., April 8-9 (1987)
  •  
  • 3. Shirakawa H, Louis EJ, MacDiarmid AG, Chiang CK, Heeger AJ, J. Chem. Soc.-Chem. Commun., 578 (1977)
  •  
  • 4. Shachlette LW, Chance RR, Ivory DM, Miller GG, Baughman RH, Synth. Met., 1, 307 (1980)
  •  
  • 5. Diaz AF, Kanazawa K, Gadini GD, J. Chem. Soc.-Chem. Commun., 635 (1979)
  •  
  • 6. Ivory DM, Miller GG, Sowa JM, Shachlette LW, Chance RR, Baughman RH, J. Chem. Phys., 71, 1505 (1979)
  •  
  • 7. Munsted H, Polymer, 29, 296 (1988)
  •  
  • 8. Chien JCW, Wnek GE, Karasz FE, Hirch JA, Macromolecules, 14, 479 (1981)
  •  
  • 9. Deits W, Cukor P, Rubner M, Jopson H, Synth. Met., 4, 199 (1982)
  •  
  • 10. Sicchel EK, Rubner MF, J. Polym. Sci. B: Polym. Phys., 23, 1629 (1985)
  •  
  • 11. Bjofklund RB, Lundstrom I, J. Elec. Mater., 13, 211 (1984)
  •  
  • 12. McChado JM, Schlenoff JB, Karasz FE, Macromolecules, 22, 1964 (1989)
  •  
  • 13. Park YH, Jung JS, J. Korean Soc. Tex. Eng. Chem., 26, 65 (1989)
  •  
  • 14. Park YH, Kim YK, Lee DS, J. Appl. Polym. Sci., 40, 1487 (1990)
  •  
  • 15. 박연홈, 이민구, 김용권, 한국 염색가공 학회지, 2, 7 (1990)
  •  
  • 16. Street BGSolid State Electronic Devices, Prentice Hall, New York, N.Y., 75 (1986)
  •  
  • 17. Mikulski CN, Russo PJ, Saran MS, MacDiarmid AJ, Garito AF, Heeger AJ, J. Am. Chem. Soc., 97, 6358 (1975)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1991; 15(1): 1-7

    Published online Feb 25, 1991

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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