Communication
  • Physical Properties of Water-Based Acryl Wig Pressure Sensitive Adhesive
  • Jung-Won Kim

  • Dept. of Costmetology, Changshin Univ., 262, Paryong-ro, MasanHoiwon-gu, Changwon-si, Gyeongsangnam-do, Korea

  • 수성 아크릴 가모용 점착제 물성연구
  • 김정원

  • 창신대학교 미용예술학과

  • Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.

References
  • 1. Wang, X.; Sudol, E. D.; El-Aasser, M. S. Mechanism of Emulsion Polymerization of Styrene Using a Reactive Surfactant. J. Polym. Sci. 2001, 39, 3093-3105.
  •  
  • 2. Lakrout, H.; Sergot, P.; Creton, C. Direct Observation of Cavitation and Fibrillation in a Probe Tack Experiment on Model Acrylic Pressure-Sensitive-Adhesives. J. Adhes. 2006, 69, 307-359.
  •  
  • 3. Czech, Z; Wesolowska, M. Development of Solvent-free Acrylic Pressure-sensitive Adhesives. Eur. Polym. J. 2007, 43, 3604-3612.
  •  
  • 4. Tobing, S. D.; Klein, A. Depolymerization of Polyethylenetere- phthalate in Supercritical Methanol. J. Appl. Polym. Sci. 2001, 81, 2109-2117.
  •  
  • 5. Czech, Z; Wesolowska M. Development of Solvent-free Acrylic Pressure-sensitive Adhesives. Eur. Polym. J. 2007, 43, 3604-3612.
  •  
  • 6. Seo, I. S.; Lee, M. C. Effects of Intra-particle Composition on the Adhesive Properties and Water Dispersity of Water Dispersible Acrylic Emulsion Pressure Sensitive Adhesive. J. Korean Ind. Eng. Chem. 2007, 18, 444-448.
  •  
  • 7. Lopez, A.; Contraires, E. D.; Canetta, E.; Creton, C.; Keddie, J. L.; Asua, J. M. Waterborne Polyurethane-Acrylic Hybrid Nanoparticles by Miniemulsion Polymerization: Applications in Pressure-Sensitive Adhesives. Langmuir 2011, 27, 3878-3888.
  •  
  • 8. Lee, S. C.; Jeong, N. H. Synthesis of Water-based Acryl Pressure Sensitive Adhesive for Skin Using Reactive Emulsifier. Appl. Chem. Eng. 2019, 30, 352-357.
  •  
  • 9. Min, H. J.; Kim, J. H. Preparation and Evaluation of a Cosmetic Adhesive containing Chitosan and Hypoallergenic Materials. J. Korean Beauty Soc. 2016, 22, 412-418.
  •  
  • 10. Mallegol, J.; Gorce, J. P.; Dupont, O.; Jeynes, C.; McDonald, P. J.; Keddie, J. L. Origins and Effects of a Surfactant Excess near the Surface of Waterborne Acrylic Pressure-Sensitive Adhesives. Langmuir 2002, 18, 4478-4487.
  •  
  • 11. Joo, H. S.; Park, Y. J.; Do, H. S.; Kim, H. J.; Song, S. Y.; Choi, K. Y. Shed Configuration Optimization for Ice-Covered Extra High Voltage Composite Insulators. J. Adhes. Sci. Technol. 2012, 21, 575-591.
  •  
  • 12. Falsafi, A.; Tirrell, M. Compositional Effects on the Adhesion of Acrylic Pressure Sensitive Adhesives. Langmuir 2000, 16, 1816-1824.
  •  
  • 13. Li, L.; Tirrell, M.; Korba, G. A.; Pocius, A. V. Surface Energy and Adhesion Studies on Acrylic Pressure Sensitive Adhesives. J. Adhes.2001, 76, 307-334.
  •  
  • 14. Song, S. H.; Kim, Y. S.; Cho, U. R. A Study on Synthesis of Starch-acryl Pressure Sensitive Adhesive by Soap-free Emulsion Polymerization. Elastomers Compos. 2009, 44, 429-435.
  •  
  • 15. Kraus, G.; Rollmann, K. W. The Entanglement Plateau in the Dynamic Modulus of Rubbery Styrene-diene Block Copolymers. Significance to Pressure-sensitive Adhesive Formulations. J. Appl. Polym. 1977, 21, 3311-3318.
  •  
  • 16. Christensen, S. F.; Everland, H.; Hassager, O.; Almdal, K. Observations of Peeling of a Polyisobutylene-based Pressure-sensitive Adhesive. Int. J. Adhes. Adhes. 1998, 18, 131-137.
  •  
  • 17. Minghetti, P.; Cilurzo, F.; Tosi, L., Casiraghi, A.; Montanari, L. Design of a New Water-soluble Pressure-sensitive Adhesive for Patch Preparation. AAPS PharmSciTech. 2003, 4, 53-61.
  •  
  • 18. Toyama, M.; Ito, T.; Nukatsuka, H.; Ikeda, M. Studies on Tack of Pressure-sensitive Adhesive Tapes: On the Relationship Between Pressure-sensitive Adhesion and Surface Energy of Adherends. J. Appl. Polym. 1973, 17, 3495-3502.
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2022; 46(1): 1-5

    Published online Jan 25, 2022

  • 10.7317/pk.2022.46.1.1
  • Received on Nov 24, 2021
  • Revised on Dec 1, 2021
  • Accepted on Dec 1, 2021

Correspondence to

  • Jung-Won Kim
  • Dept. of Costmetology, Changshin Univ., 262, Paryong-ro, MasanHoiwon-gu, Changwon-si, Gyeongsangnam-do, Korea

  • E-mail: won104@cs.ac.kr