Article
  • Heat Radiating Material with Paraffin Microencapsule and Alumina
  • So Yeon Bae, Sang Yeol Jeon, PilHo Huh, and Nam-Ju Jo

  • Department of Polymer Science and Engineering, Pusan National University, 2, Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan 46241, Korea

  • 파라핀 마이크로인캡슐과 알루미나로 이루어진 방열 소재
  • 배소연 ·전상열 ·허필호 ·조남주

  • 부산대학교 고분자공학과

  • Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.

References
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  • 4. Yu, A.; Ramesh, P.; Itkis, M. E.; Bekyarova, E.; Haddon, R. C. Graphite Nanoplatelet-Epoxy Composite Thermal Interface Materials. J. Phys. Chem. C 2007, 111, 7565-7569.
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  • 5. Jeong, H. S. Analysis of Market Trends and Commercialization Issues of Heat Dissipating Materials and Heat Dissipating Bonding Technology; KISTI: Seoul, Korea, 2013.
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  • 6. Kim, B. J.; Baek, K. Y. Special Planning: Block Copolymer-Inorganic Nanoparticle Composite Material. NICE 2010, 28, 714-719.
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  • 7. Park, C. S.; Lee, J. W.; Jo, N.-J. Microencapsulation of Thermo- plastic Polyurethane by Solvent Evaporation Method. Polym. Korea 2019, 43, 92-98.
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2018 Impact Factor : 0.500
  • Indexed in SCIE

This Article

  • 2021; 45(5): 673-679

    Published online Sep 25, 2021

  • 10.7317/pk.2021.45.5.673
  • Received on Mar 3, 2021
  • Revised on May 4, 2021
  • Accepted on May 11, 2021

Correspondence to

  • Nam-Ju Jo
  • Department of Polymer Science and Engineering, Pusan National University, 2, Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan 46241, Korea

  • E-mail: namjujo@pusan.ac.kr