Article
  • Cure Kinetics and Chemorheology of Silicone Rubber Modified Epoxy/Clay Nanocomposites

  • Sangmook Lee†

  • Division of Chemical Engineering, Dankook University, 126 Jukjeon-dong, Suji-gu, Gyeonggi-do 16890, Korea

  • 실리콘 고무로 개질된 에폭시/클레이 나노콤포지트의 경화속도론 및 화학유변학

  • 이상묵†

  • 단국대학교 화학공학과

References
  • 1. R. Bagheri, B. T. Marouf, and R. A. Pearson, Polym. Rev., 49, 201 (2009).
  •  
  • 2. L.-X. Gong, L. Zhao, L.-C. Tang, H.-Y. Liu, and Y.-W. Mai, Compos. Sci. Technol., 121, 104 (2015).
  •  
  • 3. H. Zhou and S. Xu, Mater. Lett., 121, 238 (2014).
  •  
  • 4. S. A. Xu, G. T. Wang, and Y. W. Mai, J. Mater. Sci., 48, 3546 (2013).
  •  
  • 5. S. K. Rath, J. G. Chavan, S. Sasane, Jagannath, M. Patri, A. B. Samui, and B. C. Chakraborty, Appl. Surf. Sci., 256, 2440 (2010).
  •  
  • 6. A. A. Prabu and M. Alagar, Prog. Org. Coat., 49, 236 (2004).
  •  
  • 7. T. H. Hsieh, A. J. Kinloch, K. Masania, J. S. Lee, A. C. Taylor, and S. Sprenger, J. Mater. Sci., 45, 1193 (2010).
  •  
  • 8. J. J. Chrusciel and E. Lesniak, Prog. Polym. Sci., 41, 67 (2015).
  •  
  • 9. R. Li, H. Zhang, C. Zhou, B. Zhang, Y. Chen, H. Zou, and M. Liang, Appl. Polym. Sci., 134, 45272 (2017).
  •  
  • 10. B. Li, C. He, W. Lu, J. Wang, Y. Zeng, and B. Gao, Prog. Org. Coat., 126, 178 (2019).
  •  
  • 11. Z. Niu, G. Liu, H. Yin, C. Zhou, D. Wu, B. Yousaf, and C. Wang, Energ. Convers. Manage., 124, 180 (2016).
  •  
  • 12. G. Zheng, L. Polavarapu, L. M. Liz-Marzan, I. Pastoriza-Santos, and J. Perez-Juste, Chem. Comm., 51, 4572 (2015).
  •  
  • 13. M. Cha, K. Shin, H. Lee, I. L. Moudrakovski, J. A. Ripmeester, and Y. Seo, Environ. Sci. Tehnol., 49, 1964 (2015).
  •  
  • 14. Q.-V. Bach and W.-H. Chen, Bioresource Technol., 246, 88 (2017).
  •  
  • 15. K. Azizi, M. K. Moraveji, and H. A. Najafabadi, Bioresource Technol., 243, 481 (2017).
  •  
  • 16. Y. Lin, Y. Liao, Z. Yu, S. Fang, Y. Lin, Y. Fan, X. Peng, and X. Ma, Energ. Convers. Manage., 118, 345 (2016).
  •  
  • 17. J. Hu, J. Shan, J. Zhao, and Z. Tong, Thermochim. Acta, 632, 56 (2016).
  •  
  • 18. J. Xu, Y. Jiang, T. Zhang, Y. Dai, D. Yang, F. Qiu, Z. Yu, and P. Yang, Prog. Org. Coat., 122, 10 (2018).
  •  
  • 19. J. D. Thanki and P. H. Parsania, J. Therm. Anal. Calorim., 130, 2145 (2017).
  •  
  • 20. J. Park and S. C. Jana, Polymer, 45, 7673 (2004).
  •  
  • 21. S. K. Sahoo, S. Mohanty, and S. K. Nayak, Prog. Org. Coat., 88, 263 (2015).
  •  
  • 22. P. I. Xidas and K. S. Triantafyllidis, Eur. Polym. J., 46, 404 (2010).
  •  
  • 23. H. E. Kissinger, Anal. Chem., 29, 1702 (1957).
  •  
  • 24. X. Sheng, M. Akinc, and M. R. Kessler, J. Therm. Anal. Calorim., 93, 77 (2008).
  •  
  • 25. G. Gheno, R. Ganzerla, M. Bortoluzzi, and R. Paganica, Prog. Org. Coat., 78, 239 (2015).
  •  
  • 26. M. R. Kamal and M. E. Ryan, Polym. Eng. Sci., 20, 859 (1980).
  •  
  • 27. N. Rabearison, Ch. Jochum, and J. C. Grandidier, J. Mater. Sci., 46, 787 (2011).
  •  
  • 28. F. X. Perrin, T. M. H. Nguyen, and J. L. Vernet, Eur. Polym. J., 43, 5107 (2007).
  •  
  • 29. C. D. Han and K. W. Lem, Polym. Eng. Sci., 24, 473 (1984).
  •  
  • 30. K. C. Cole, J. J. Hechler, and D. Noel, Macromolecules, 24, 3098 (1991).
  •  
  • 31. S. Montserrat, G. Andreu, P. Cortes, Y. Calventus, P. Colomer, J. M. Hutchinson, and J. Malek, J. Appl. Polym. Sci., 61, 1663 (1996).
  •  
  • 32. R. A. Fava, Polymer, 9, 137 (1968).
  •  
  • 33. Cure behavior by dynamic mechanical analysis ASTM D4473.
  •  
  • 34. H. Teil, S. A. Page, V. Michaud, and J.-A. E. Manson, J. Appl. Polym. Sci., 93, 1774 (2004).
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2020; 44(2): 163-169

    Published online Mar 25, 2020

  • 10.7317/pk.2020.44.2.163
  • Received on Oct 28, 2019
  • Revised on Dec 7, 2019
  • Accepted on Dec 23, 2019

Correspondence to

  • Sangmook Lee

  • Division of Chemical Engineering, Dankook University, 126 Jukjeon-dong, Suji-gu, Gyeonggi-do 16890, Korea

  • E-mail: s_mlee@naver.com