Article
  • Comparative Performances of Electrically Conductive Adhesives by Incorporation of Silver, Silver-Coated Copper, and Graphene
  • Kyung-Soo Sung and Namil Kim*,†

  • Research & Development Center, Protavic Korea, Daejeon 34326, Korea
    *Environmental Materials R&D Center, Korea Automotive Technology Institute, Chungnam 31214, Korea

  • 은, 은 코팅된 구리, 그래핀 첨가에 따른 도전성 접착제의 성능 비교
  • 성경수 · 김남일*,†

  • (주)프로타빅코리아 연구개발부, *자동차부품연구원 친환경소재연구센터

References
  • 1. V. R. Manikam and K. Y. Cheong, IEEE Trans. Compon. Packag. Manuf. Tech., 1, 457 (2011).
  •  
  • 2. Y. Li and C. P. Wong, Mater. Sci. Eng. R, 51, 1 (2006).
  •  
  • 3. I. Mir and D. Kumar, Int. J. Adhes. Adhes., 28, 362 (2008).
  •  
  • 4. H.-W. Cui, Q. Fan, and D.-S. Li, Int. J. Adhes. Adhes., 48, 177 (2014).
  •  
  • 5. Y. Guan, X. Chen, F. Li, and H. Gao, Int. J. Adhes. Adhes., 30, 80 (2010).
  •  
  • 6. H. Jiang, K. S. Moon, Y. Li, and C. P. Wong, Chem. Mater., 18, 2969 (2006).
  •  
  • 7. H.-M. Ren, K. Zhang, Y. M. Matthew, X.-Z. Fu, R. Sung, and C. P. Wong, J. Solid State Light, 1, 1 (2014).
  •  
  • 8. R. Zhang, W. Lin, K. Lawrence, and C. P. Wong, Int. J. Adhes. Adhes., 30, 403 (2010).
  •  
  • 9. H. Nishikawa, S. Mikami, K. Miyake, A. Aoki, and T. Takemoto, Mater. Trans., 51, 1785 (2010).
  •  
  • 10. C. K. Kim, G. J. Lee, M. K. Lee, and C. K. Rhee, Powder Technol., 263, 1 (2014).
  •  
  • 11. A. Santamaria, M. E. Munoz, M. Fernandez, and M. Landa, J. Appl. Polym. Sci., 129, 1643 (2013).
  •  
  • 12. H.-W. Cui, A. Kowalczyk, D.-S. Li, and Q. Fan, Int. J. Adhes. Adhes., 44, 220 (2013).
  •  
  • 13. H. Ma, M. Ma, J. Zeng, X. Guo, and Y. Ma, Mater. Lett., 178, 181 (2016).
  •  
  • 14. B. M. Amoli, J. Trinidad, G. Rivers, S. Sy, P. Russo, A. Yu, N. Y. Zhou, and B. Zhao, Carbon, 91, 188 (2015).
  •  
  • 15. W. Yuan, Q. Xiao, L. Li, and T. Xu, Appl. Therm. Eng., 103, 1067 (2016).
  •  
  • 16. R. Ma, S. Y. Kwon, Q. Zheng, H. Y. Kwon, J. I. Kim, H. R. Choi, and S. H. Baik, Adv. Mater., 24, 3344 (2012).
  •  
  • 17. Y. Zhang, S. Qi, X. Wu, and G. Duan, Synth. Met., 161, 516 (2011).
  •  
  • 18. H. P. Wu, X. J. Wu, M. Y. Ge, G. Q. Zhang, Y. W. Wang, and J. Jiang, Compos. Sci. Technol., 67, 1182 (2007).
  •  
  • 19. F. Marcq, P. Demont, P. Monfraix, A. Peigney, Ch. Laurent, T. Falat, F. Courtade, and T. Jamin, Microelectron Reliab., 51, 1230 (2011).
  •  
  • 20. H. Li and C. P. Wong, IEEE Trans. Adv. Packag., 27, 165 (2004).
  •  
  • 21. D. Lu, C. P. Wong, and Q. K. Tong, IEEE Trans. Compon. Packag. Manuf. Tech. C, 22, 228 (1999).
  •  
  • 22. H. Jiang, M. J. Yim, W. Lin, and C. P. Wong, IEEE Trans. Compon. Packag. Tech., 32, 754 (2009).
  •  
  • 23. Y. Yosida, J. Appl. Phys., 87, 3338 (2000).
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2019; 43(5): 728-734

    Published online Sep 25, 2019

  • 10.7317/pk.2019.43.5.728
  • Received on May 2, 2019
  • Revised on May 29, 2019
  • Accepted on Jun 3, 2019

Correspondence to

  • Namil Kim
  • Environmental Materials R&D Center, Korea Automotive Technology Institute, Chungnam 31214, Korea

  • E-mail: nikim@katech.re.kr