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References
  • 1. Morgan P, Carbon Fibers and Their Composites, CRC Press, Boca Raton, 2005.
  •  
  • 2. Rahaman MSA, Ismail AF, Mustafa A, Polym. Degrad. Stabil., 92, 1421 (2007)
  •  
  • 3. Park OK, Kim JH, Lee S, Lee JH, Chung Y, Kim J, Ku BC, Polym. Korea, 35(5), 472 (2011)
  •  
  • 4. Fitzer E, Muller DJ, Carbon, 13, 63 (1975)
  •  
  • 5. Ko TH, Ting HY, Lin CH, J. Appl. Polym. Sci., 35, 631 (1988)
  •  
  • 6. Bajaj P, Roopanwal AK, J. Macromol. Sci.-Polym. Rev, 37, 97 (1997)
  •  
  • 7. Dalton S, Heatley F, Budd PM, Polymer, 40(20), 5531 (1999)
  •  
  • 8. Brandrup J, Peebles LH, Macromolecules, 1, 64 (1968)
  •  
  • 9. Grassie N, McGuchan R, Eur. Polym. J., 7, 1091 (1971)
  •  
  • 10. Dunham MG, Edie DD, Carbon, 30, 435 (1992)
  •  
  • 11. Chae HG, Minus ML, Rasheed A, Kumar S, Polymer, 48(13), 3781 (2007)
  •  
  • 12. Ko TH, J. Appl. Polym. Sci., 42, 1949 (1991)
  •  
  • 13. Zhu Y, Wilding MA, Mukhopadhyay SK, J. Mater. Sci., 31(14), 3831 (1996)
  •  
  • 14. Xue Y, Liu J, Liang J, Polym. Degrad. Stabil., 98, 219 (2013)
  •  
  • 15. Gupta A, Harrison IR, Carbon, 34, 1427 (1996)
  •  
  • 16. Lee SW, Lee HY, Jang SY, Jo SM, Lee HS, Lee S, Carbon Lett., 12, 16 (2011)
  •  
  • 17. Lee S, Kim J, Ku BC, Kim J, Chung Y, Carbon Lett., 12, 26 (2011)
  •  
  • 18. Ji MX, Wang CG, Bai YJ, Yu MJ, Wang YX, Polym. Bull., 59(4), 527 (2007)
  •  
  • 19. Mathur RB, Bahl OP, Mittal J, Nagpal KC, Carbon, 29, 1059 (1991)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2016; 40(6): 972-976

    Published online Nov 25, 2016

  • 10.7317/pk.2016.40.6.972
  • Received on Jun 29, 2016
  • Revised on Nov 30, -0001
  • Accepted on Aug 22, 2016

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