Article
  • Deposition Strength of Specimens Manufactured Using Fused Deposition Modeling Type 3D Printer
  • Park SJ, Park JH, Lee KH, Lyu MY
  • 압출 적층 방식의 3D 프린팅 조형물에서 적층강도에 대한 고찰
  • 박성제, 박정현, 이권행, 류민영
References
  • 1. Ahn DG, Lee SH, Kim KD, Yang DY, Trans. Mater. Process., 11, 323 (2002)
  •  
  • 2. Kim GD, Kim JY, Transact. Korea Soc. Machine Tool Eng., 15, 56 (2006)
  •  
  • 3. Park C, Kim MH, Hong SM, Go JS, Shin BS, J. Korean Soc. Manuf. Technol. Eng., 24, 334 (2015)
  •  
  • 4. Chuk RN, Thomson VJ, Rapid Prototyping J., 4, 185 (1998)
  •  
  • 5. Kumar S, Kruth JP, Mater. Des., 31, 850 (2010)
  •  
  • 6. Ramanath HS, Chandrasekaran M, Chua CK, Leong KF, Shah KD, Key Eng. Mater., 334, 1241 (2007)
  •  
  • 7. Ma W, But WC, He P, Computer-Aied Design, 36, 1309 (2004)
  •  
  • 8. Dawoud M, Taha I, Ebeid SJ, J. Manuf. Processes, 21, 39 (2016)
  •  
  • 9. Ahn SH, Montero M, Odell D, Roundy S, Wright PK, Rapid Prototyping J., 8, 248 (2002)
  •  
  • 10. Ziemian CW, Cipoletti DE, Ziemian SN, Okwara MN, Haile KV, Annual International Solid Freeform Fabrication Symposium 2014, 525 (2014)
  •  
  • 11. Es-said OS, Foyos J, Boorani R, Mendelson M, Marloth R, Mater. Manuf. Processes, 5, 107 (2000)
  •  
  • 12. Liu X, LI S, Liu Z, Zheng X, Chen X, Wang Z, Int. Adv. Manuf. Technol., 79, 1117 (2015)
  •  
  • 13. Montero M, Roundy S, Odell D, Ahn SH, Wright PK, Proceedings of Rapid Prototyping and Manufacturing Conference, 1 (2001)
  •  
  • 14. Haid CM, Doctoral dissertation, Massachusetts Institute of Technology (2014).
  •  
  • 15. Kim GD, Sung JH, J. Kor. Soc. Precis. Eng., 23, 187 (2006)
  •  
  • 16. Sun Q, Rizvi GM, Bellehumeur CT, Gu P, Rapid Prototyping J., 14, 72 (2008)
  •  
  • 17. Kim GD, Oh YT, Proc. IMechE, Part B: J. Engineering Manufacture, 222, 201 (2008)
  •  
  • 18. Reddy BV, Reddy NV, Ghosh A, Virtual Phys. Prototyp., 2, 51 (2007)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2016; 40(6): 846-851

    Published online Nov 25, 2016

  • 10.7317/pk.2016.40.6.846
  • Received on Mar 1, 2016
  • Revised on Nov 30, -0001
  • Accepted on Jun 10, 2016

Correspondence to

  • E-mail: