Article

The Effect of Modified Alumina for Fabrication of Thermal Conductive Acrylic Pressure Sensitive Adhesive
Oh JH, Kang S, Xiangxu L, No SR, You SS, Cho UR
방열 아크릴 점착제의 제조를 위한 개질 알루미나의 효과
오지환, 강신혜, 리시앙수, 노성래, 유성식, 조을룡

References

1. Liang YC, Zhang JN, Li M, Guo YP, Yuan JS, Prz. Electrotech., 88, 328 (2012)
2. McGlen RJ, Jachuck R, Lin S, Appl. Therm. Eng., 24, 1143 (2004)
3. McNamara AJ, Joshi Y, Zhang ZM, Int. J. Therm. Sci., 96, 221 (2015)
4. Tang B, Hu GX, Gao HY, Hai LY, Int. J. Heat Mass Transf., 85(-), 420 (2015)
5. Fu Y, He Z, Mo D, Lu S, Appl. Therm. Eng., 66, 493 (2014)
6. Yim MJ, Li Y, Moon KS, Paik KW, Wong CP, J. Adhes. Sci. Technol., 22(14), 1593 (2008)
7. Trabelsi W, Mountemor MF, Surf. Coat. Technol., 192, 284 (2005)
8. Nishiyama N, Asakura T, Horie K, J. Colloid Interface Sci., 124, 14 (1988)
9. Xie Y, Callum C, Hill AS, Xiao Z, Militz H, Mai C, Compos. Pt. A-Appl. Sci. Manuf., 41, 806 (2010)
10. Bae YH, Park GD, Jung HO, Vu MC, Kim SR, Polym. Korea, 40(1), 148 (2016)
11. Akiyama S, Kobori Y, Sugisaki A, Koyama T, Akiba I, Polymer, 41(11), 4021 (2000)
12. Parvaiz MR, Polym. Compos., 33, 1798 (2012)
13. Yim A, Chahal RS, St Pierre LE, J. Colloid Interface Sci., 43, 583 (1973)
14. Czech Z, Int. J. Adhes. Adhes., 26, 414 (2006)
15. Choi YH, Kang JK, Lee WK, J. Adhesion Interface, 10, 1 (2009)
16. Sowa D, Czech Z, Byczynski L, Int. J. Adhes. Adhes., 49, 38 (2014)
17. Yamamoto Y, Fujii S, Shitajima K, Fujiwara K, Hikasa S, Nakamura Y, Polymer, 70(-), 77 (2015)
18. Lim CH, Ryu H, Cho UR, Polym. Korea, 33(4), 319 (2009)

Polymer(Korea) 폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE