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  • 박규대, 최원국, 이성구, 김경민, 김성룡
References
  • 1. Yilgor I, Yilgor E, Polym. Bull., 40(4-5), 525 (1998)
  •  
  • 2. Ng JMK, Gitlin I, Stroock AD, Whitesides GM, Electrophoresis, 23(20), 3461 (2002)
  •  
  • 3. Fernandes MS, Lee KS, Ram RJ, Correia JH, Mendes PM, Proc. IEEE 32nd Annu. Int. Conf. Eng. Med. Biol. Soc., 3503 (2010)
  •  
  • 4. Yang LJ, Wang HH, Yang PC, Chung YC, Sheu TS, Sensors and Materials, 19, 391 (2007)
  •  
  • 5. Odom TW, Love JC, Wolfe DB, Paul KE, Whitesides GM, Langmuir, 18(13), 5314 (2002)
  •  
  • 6. Antonisse MMG, Engbersen JFJ, Reinhoudt DN, 1995 Nitrate and Bicarbonate Selective CHEMFET Proc. Transducers '95 (Stockholm), 867 (1995).
  •  
  • 7. Myers AC, Huangc H, Zhu Y, RSC Adv., 5, 11627 (2015)
  •  
  • 8. Bae YH, Park GD, Jung HO, Vu MC, Kim SR, Polym. Korea, 40(1), 148 (2016)
  •  
  • 9. Fu YX, He ZX, Mo DC, Lu SS, Appl. Therm. Eng., 66, 493 (2014)
  •  
  • 10. Renteria JD, Nika DL, Balandin AA, Appl. Sci., 4, 525 (2014)
  •  
  • 11. Xiao X, Zhang P, Li M, Energy Conv. Manag., 73(-), 86 (2013)
  •  
  • 12. Zheng W, Wong SC, Compos. Sci. Technol., 63, 225 (2003)
  •  
  • 13. Xu F, Zhu Y, Adv. Mater., 24(37), 5117 (2012)
  •  
  • 14. Arafat Y, Dutta I, Panat R, Appl. Phys. Lett., 107, 081906 (2015)
  •  
  • 15. Pan YX, Yu ZZ, Ou YC, Hu GH, J. Polym. Sci. B: Polym. Phys., 38(12), 1626 (2000)
  •  
  • 16. Wang WP, Liu Y, Li XX, You YZ, J. Appl. Polym. Sci., 100(2), 1427 (2006)
  •  
  • 17. Kim SR, Poostforush1 M, Kim JH, Lee SG, eXPRESS Polym. Lett., 6, 476 (2012)
  •  
  • 18. Chen H, Botef I, Zheng H, Maaza M, Rao VV, Srinivasu VV, Int. J. Nanotechnol., 8, 437 (2011)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2016; 40(2): 336-340

    Published online Mar 25, 2016

  • 10.7317/pk.2016.40.2.336
  • Received on Jan 9, 2016
  • Revised on Nov 30, -0001
  • Accepted on Feb 14, 2016

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