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Submitted (~23-08-31)
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Submitted (23-09-01~)
Article
Thermal Conductivity Improvement by Cu Surface Treatments and Incorporation of PMMA Beads on Cu/Epoxy Composites
Bae YH, Park GD, Jung HO, Vu MC, Kim SR
구리 필러의 표면처리와 PMMA 비드 첨가에 따른 Cu/Epoxy 복합재료의 열전도도 향상
배영한, 박규대, 정현옥, 부민칸, 김성룡
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Polymer(Korea)
폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE
This Article
2016; 40(1): 148-153
Published online Jan 25, 2016
10.7317/pk.2016.40.1.148
Received on Oct 12, 2015
Revised on Nov 30, -0001
Accepted on Oct 29, 2015
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