Article
  • Influence of Molecular Weight on Swelling and Elastic Modulus of Hyaluronic Acid Dermal Fillers
  • Lee DY, Cheon C, Son S, Kim YZ, Kim JT, Jang JW, Kim SS
  • 히알루론산 피부용 필러의 분자량에 따른 팽윤도와 탄성계수 영향
  • 이득용, 전철병, 손시원, 김영주, 김진태, 장주웅, 김석순
References
  • 1. Kim J, Choi J, Park S, Lee DY, Natural. Sci., 2, 764 (2010)
  •  
  • 2. Kim JT, Lee DY, Kim T, Lee M, Cho N, Met. Mater. Int., 20, 555 (2014)
  •  
  • 3. Kim J, Lee DY, Kim E, Jang J, Cho N, Tissue Eng. Regen. Med., 11, 32 (2014)
  •  
  • 4. Choi C, Park JK, Kim WS, Jang MK, Nah JW, Polym.(Korea), 35(2), 119 (2011)
  •  
  • 5. Nam HS, Kim JH, An JH, Chung DJ, Polym.(Korea), 25(4), 476 (2001)
  •  
  • 6. Hong IR, Kim YJ, Polym.(Korea), 32(6), 561 (2008)
  •  
  • 7. De Boulle K, Glogau R, Kono T, Nathan M, Tezel A, Roca-Martinez J, Dermatol. Surg., 39, 1758 (2013)
  •  
  • 8. Kim J, Kim IS, Cho TH, Lee KB, Hwang SJ, Tae G, Noh I, Lee SH, Park Y, Sun K, Biomater., 28, 1830 (2007)
  •  
  • 9. Park HS, Kim AR, Noh I, Biomater. Res., 17, 153 (2013)
  •  
  • 10. Edsman K, Nord LI, Ohrlund A, Larkner H, Kenne AH, Dermatol. Surg., 38, 1170 (2012)
  •  
  • 11. Flynn TC, Sarazin D, Beexxola A, Terrani C, Micheels P, Dermatol. Surg., 37, 637 (2011)
  •  
  • 12. Kablik J, Monheit GD, Yu L, Chang G, Gershkovich J, Dermatol. Surg., 35, 302 (2009)
  •  
  • 13. La Gatta A, Schiraldi C, Papa A, De Rosa M, Polym. Degrad. Stabil., 96, 630 (2011)
  •  
  • 14. Allemann I, Baumann L, Clin. Interv. Aging, 3, 629 (2008)
  •  
  • 15. Fakhari A, Phan Q, Thakkar SV, Middaugh CR, Berkland C, Langmuir, 29(17), 5123 (2013)
  •  
  • 16. Hu Z, Xia X, Tang L, U.S. Patent 0040892A1 (2006).
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(6): 976-980

    Published online Nov 25, 2015

  • 10.7317/pk.2015.39.6.976
  • Received on Jul 16, 2015
  • Revised on Nov 30, -0001
  • Accepted on Aug 3, 2015

Correspondence to

  • E-mail: