Article
  • Fabrication of Microparticles with Anisotropic Patchy Based on Sequential Micromolding Technique
  • Lee B, Choi CH, Kim J, Kang SM, Nam JO, Jin SH, Lee CS
  • 순차적 마이크로 몰딩 방법을 이용한 이방성 패치 입자 제조 기술
  • 이병진, 최창형, 김종민, 강성민, 남진오, 진시형, 이창수
References
  • 1. Champion JA, Katare YK, Mitragotri S, P. Natl. Acad. Sci. USA, 104, 11901 (2007)
  •  
  • 2. Langer R, Tirrell DA, Nature, 428, 487 (2004)
  •  
  • 3. Guang Y, Lee JK, Polym.(Korea), 37(3), 356 (2013)
  •  
  • 4. Lee HS, Park JH, Polym.(Korea), 38(3), 391 (2014)
  •  
  • 5. Devi MG, Dutta S, Hinai ATA, Feroz S, Korean J. Chem. Eng., 32(1), 118 (2015)
  •  
  • 6. Liddell CM, Summers CJ, Gokhale AM, Mater. Charact., 50, 69 (2003)
  •  
  • 7. Glotzer SC, Horsch MA, Iacovella CR, Zhang ZL, Chan ER, Zhang X, Curr. Opin. Colloid In., 10, 287 (2005)
  •  
  • 8. Malescio G, Pellicane G, Phys. Rev. E, 70, 021202 (2004)
  •  
  • 9. Pawar AB, Kretzschmar I, Aranovich G, Donohue MD, J. Phys. Chem. B, 111(8), 2081 (2007)
  •  
  • 10. Vanakaras AG, Langmuir, 22(1), 88 (2006)
  •  
  • 11. Witman JE, Wang ZG, J. Phys. Chem. B, 110(12), 6312 (2006)
  •  
  • 12. Zhang ZL, Glotzer SC, Nano Lett., 4, 1407 (2004)
  •  
  • 13. Doppelbauer G, Noya EG, Bianchi E, Kahl G, J. Phys. Condens. Matter, 24, 284124 (2012)
  •  
  • 14. Zhang P, Liu Y, Xia J, Wang Z, Kirkland B, Guan J, Adv. Healthc. Mater., 2, 540 (2013)
  •  
  • 15. Choi CH, Kang SM, Jin SH, Yi H, Lee CS, Langmuir, 31(4), 1328 (2015)
  •  
  • 16. Park BJ, Korean Chem. Eng. Res., 51(6), 655 (2013)
  •  
  • 17. Guo RH, Mao J, Xie XM, Yan LT, Sci. Rep-UK, 4, 7021 (2014)
  •  
  • 18. Wolters JR, Avvisati G, Hagemans F, Vissers T, Kraft DJ, Dijkstra M, Kegel WK, Soft Matter, 11, 1067 (2015)
  •  
  • 19. Charnay C, Lee A, Man SQ, Moran CE, Radloff C, Bradley RK, Halas NJ, J. Phys. Chem. B, 107(30), 7327 (2003)
  •  
  • 20. Ho CC, Chen WS, Shie TY, Lin JN, Kuo C, Langmuir, 54, 5663 (2008)
  •  
  • 21. Jang SG, Choi DG, Heo CJ, Lee SY, Yang SM, Adv. Mater., 20(24), 4862 (2008)
  •  
  • 22. Park JY, Korean J. Chem. Eng., 31(4), 541 (2014)
  •  
  • 23. Lee C, Kim J, Chang H, Roh KM, Jang HD, Korean Chem. Eng. Res., 53(1), 78 (2015)
  •  
  • 24. Bhaskar S, Pollock KM, Yoshida M, Lahann J, Small, 6, 404 (2010)
  •  
  • 25. Lee KJ, Hwang S, Yoon J, Bhaskar S, Park TH, Lahann J, Macromol. Rapid Commun., 32(5), 431 (2011)
  •  
  • 26. Roh KH, Martin DC, Lahann J, Nat. Mater., 4(10), 759 (2005)
  •  
  • 27. Cho YS, Yi GR, Kim SH, Jeon SJ, Elsesser MT, Yu HK, Yang SM, Pine DJ, Chem. Mater., 19, 3183 (2007)
  •  
  • 28. Cho YS, Yi GR, Lim JM, Kim SH, Manoharan VN, Pine DJ, Yang SM, J. Am. Chem. Soc., 127(45), 15968 (2005)
  •  
  • 29. Cho YS, Yi GR, Kim SH, Elsesser MT, Breed DR, Yang SM, J. Colloid Interface Sci., 318, 124 (2008)
  •  
  • 30. Cho YS, Moon JW, Lim DC, Kim YD, Korean J. Chem. Eng., 30(5), 1142 (2013)
  •  
  • 31. Pawar AB, Kretzschmar I, Macromol. Rapid Commun., 31(2), 150 (2010)
  •  
  • 32. Yang M, Wang G, Ma HT, Chem. Commun., 47, 911 (2011)
  •  
  • 33. Kim JW, Larsen RJ, Weitz DA, Adv. Mater., 19(15), 2005 (2007)
  •  
  • 34. Bu JH, Kim Y, Ha JU, Shim SE, Polym.(Korea), 39(1), 78 (2015)
  •  
  • 35. Choi CH, Lee J, Yoon K, Tripathi A, Stone HA, Weitz DA, Lee CS, Angew. Chem.-Int. Edit., 49, 7748 (2010)
  •  
  • 36. Choi CH, Jeong JM, Kang SM, Lee CS, Lee J, Adv. Mater., 24(37), 5078 (2012)
  •  
  • 37. Choi CH, Kim J, Kang SM, Lee J, Lee CS, Langmuir, 29(27), 8447 (2013)
  •  
  • 38. Song YS, Lee CS, Korean Chem. Eng. Res., 52(5), 632 (2014)
  •  
  • 39. Kang SM, Kumar A, Choi CH, Tettey KE, Lee CS, Lee D, Park BJ, Langmuir, 30(44), 13199 (2014)
  •  
  • 40. Xu J, Wong DHC, Byrne JD, Chen K, Bowerman C, DeSimone JM, Angew. Chem.-Int. Edit., 52, 6580 (2013)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(5): 814-819

    Published online Sep 25, 2015

  • 10.7317/pk.2015.39.5.814
  • Received on Mar 18, 2015
  • Revised on Nov 30, -0001
  • Accepted on Apr 25, 2015

Correspondence to

  • E-mail: