Article

Curing and Heat Stability of Epoxy Encapsulants with Polysilazane Cross-linking Agent
Piao L, Kim JK
폴리실라잔 가교제를 이용한 LED 에폭시 봉지재의 경화와 열 안정성 연구
박용해, 김진권

References

1. Choi J, Kim SG, Laine RM, Macromolecules, 37(1), 99 (2004)
2. Muth S, Schuurmans FJP, Pashley MD, IEEE J. Sel. Top. Quantum Electron., 8, 333 (2002)
3. Bourget L, Corriu RJP, Lecercq D, Mutin PH, Vioux A, J. Non-Cryst. Solids, 242, 81 (1998)
4. Katayama S, Yamada N, Shibata Y, Nosa K, J. Cer. Soc. Jpn., 111, 391 (2003)
5. Schubert EF, Light Emitting Diodes, Cambridge University Press, UK, Cambridge, 2003.
6. Mont FW, Kim JK, Schubert MF, Schubert EF, Siege RW, J. Appl. Phys., 103, 083120 (2008)
7. Ho TH, Wang CS, Eur. Polym. J., 37, 267 (2001)
8. Rubinsztajn MI, Rubinsztajn S, U. S. Patent 6,916,889 (2005).
9. Gorczyca TB, U. S. Patent 6,800,373 (2004).
10. Huang W, Yuan Y, Yu Y, J. Adhes. Inter., 7, 39 (2006)
11. Peuckert M, Vaahs T, Bruck M, Adv. Mater., 2, 398 (1990)
12. Crivello JV, Lee JL, J. Polym. Sci. A: Polym. Chem., 28, 479 (1990)
13. Kubo T, Tataoka E, Kozuka H, J. Mater. Res., 19, 635 (2004)
14. Lijima M, Kobayakawa M, Kamiya H, J. Colloid Interface Sci., 337(1), 61 (2009)
15. Song YY, Hildebrand H, Schmuki P, Surf. Sci., 604, 346 (2010)
16. Sabzi M, Mirabedini SM, Zohuriaan MJ, Atai M, Prog. Org. Coat., 65, 222 (2009)

Polymer(Korea) 폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE