Article
  • Thermal Conductivity of Thermally Conductive Ceramic Composites and Silicon Carbide/Epoxy Composites through Wetting Process
  • Hwang Y, Kim J, Cho W
  • 세라믹 방열 복합체의 열전도도 분석 및 Wetting Process를 이용한 SiC/에폭시 복합체
  • 황용선, 김주헌, 조원철
References
  • 1. Lin W, Moon KS, Wong CP, Adv. Mater., 21(23), 2421 (2009)
  •  
  • 2. Mamunya Y, Boudenne A, Lebovka N, Ibos L, Candau Y, Lisunova M, Compos. Sci. Technol., 68, 1981 (2008)
  •  
  • 3. Yu A, Ramesh P, Itkis ME, Bekyarova E, Haddon RC, J. Phys. Chem. C, 111, 7565 (2007)
  •  
  • 4. Garimella SV, Fleischer AS, Murthy JY, Keshavarzi A, Prasher R, Patel C, IEEE Trans. Compon. Packag. Technol., 31, 801 (2008)
  •  
  • 5. Prasher R, Proc. IEEE, 94, 1571 (2006)
  •  
  • 6. Sarvar F, Whalley DC, Hutt DA, Palmer PJ, Teh NJ, Microelectron. Int., 24, 66 (2007)
  •  
  • 7. Shi Z, Radwan M, Kirihara S, Miyamoto Y, Jin Z, Appl. Phys. Lett., 95, 224104 (2009)
  •  
  • 8. Li TL, Hsu SLC, J. Phys. Chem. B, 114(20), 6825 (2010)
  •  
  • 9. Zhi CY, Bando Y, Terao T, Tang CC, Kuwahara H, Golberg D, Adv. Funct. Mater., 19(12), 1857 (2009)
  •  
  • 10. Yang F, Zhao X, Xiao P, J. Eur. Ceram. Soc., 30, 3111 (2010)
  •  
  • 11. Zhou WY, Qi SH, An QL, Zhao HZ, Liu NL, Mater. Res. Bull., 42(10), 1863 (2007)
  •  
  • 12. Terao T, Zhi C, Bando Y, Mitome M, Tang C, Golberg D, J. Phys. Chem. C, 114, 4340 (2010)
  •  
  • 13. Zhou TL, Wang X, Mingyuan GU, Liu XH, Polymer, 49(21), 4666 (2008)
  •  
  • 14. Vyazovkin S, Sbirrazzuoli N, Macromol. Chem. Phys., 201, 199 (2000)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(6): 782-786

    Published online Nov 25, 2014

  • 10.7317/pk.
  • Received on Apr 24, 2014
  • Revised on Nov 30, -0001
  • Accepted on May 19, 2014

Correspondence to

  • E-mail: