Article
  • Prediction of Mechanical Property of Glass Fiber Reinforced Polycarbonate and Evaluation of Warpage through Injection Molding
  • Moon DM, Choi TG, Lyu MY
  • 유리섬유로 강화된 폴리카보네이트의 기계적 물성예측 및 사출성형을 통한 휨의 평가
  • 문다미, 최태균, 류민영
References
  • 1. Lee M, Kim JH, Park SR, Lyu MY, Elast. Compos., 44, 373 (2009)
  •  
  • 2. Lyu MY, Kim HY, Polymer Science and Technology, 20, 157 (2009)
  •  
  • 3. Lee M, Lyu MY, Elast. Compos., 48, 300 (2013)
  •  
  • 4. Won ST, Kim TB, Lee S, Won JM, Cha KH, Lyu MY, Elast. Compos., 47, 336 (2012)
  •  
  • 5. Lyu MY, Mo JH, Chung WJ, Elast. Compos., 38, 295 (2003)
  •  
  • 6. Lyu MY, Mo JH, Trans. Mater. Process, 13, 515 (2004)
  •  
  • 7. Na HY, Yoon BC, Kim SH, Lee SJ, Elast. Compos., 48, 133 (2013)
  •  
  • 8. Lee M, Kim H, Lyu MY, Polym.(Korea), 36(5), 555 (2012)
  •  
  • 9. Lee M, Kim H, Lyu MY, Polym.(Korea), 36(6), 677 (2012)
  •  
  • 10. Liu F, Zhou H, Li DQ, J. Reinf. Plast. Compos., 28, 571 (2009)
  •  
  • 11. Chen X, Lam YC, Li DQ, J. Mater. Process. Technol., 101, 275 (2000)
  •  
  • 12. Choi DS, Im YT, Compos. Struct., 47, 655 (1999)
  •  
  • 13. Drozdov AD, Al-Mulla A, Gupta RK, Comput. Mater. Sci., 28, 16 (2003)
  •  
  • 14. Ha KC, Hwang JR, Doong JL, Polym. Polym. Compos., 4, 563 (1996)
  •  
  • 15. Digimat 4.3.1 Manual, e-Xstream Engineering (2012)
  •  
  • 16. Pierard O, Doghri I, Int. J. Mult. Comp. Eng., 4, 521 (2006)
  •  
  • 17. Pierard O, Gonzalez C, Segurado J, Lorca JL, Doghri I, Int. J. Solids Struct., 42, 6945 (2007)
  •  
  • 18. Doghri I, Tinel L, Int. J. Plasticity, 21, 1919 (2005)
  •  
  • 19. Park JW, Ahn JH, Park YM, Lyu MY, Elast. Compos., 47, 347 (2012)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(6): 708-713

    Published online Nov 25, 2014

  • 10.7317/pk.
  • Received on Feb 21, 2014
  • Revised on Nov 30, -0001
  • Accepted on Apr 20, 2014

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